Diffusion bonding method for microchannel plates

Details Diffusion bonding method for microchannel plates Diffusion bonding method for microchannel plates

2005-09-06

2005-09-06

Stoner, Kiley S. (Department: 1725)

Metal fusion bonding

Process

Diffusion type

C228S122100, C348S217100, C348S777000

Reexamination Certificate

active

06938817

ABSTRACT:
A microchannel plate (MCP) (50) and a dielectric insulator (80) are deposited with a thin film (54, 84) using a suitable metal selected for optimum diffusion. The metallized MCP (50) and dielectric insulator (80) are then aligned and placed in a bonding fixture (36) that provides the necessary force applied to the components to initiate a diffusion bond. The bonding fixture (36) is then placed in a vacuum heat chamber to accelerate the diffusion bonding process between the MCP (50) and the dielectric insulator (80).

REFERENCES:
patent: 5514928 (1996-05-01), Niewold
patent: 5573173 (1996-11-01), van der Wilk et al.
patent: 5632436 (1997-05-01), Niewold
patent: 5683828 (1997-11-01), Spear et al.
patent: 5994824 (1999-11-01), Thomas et al.
patent: 6040657 (2000-03-01), Vrescak et al.
patent: 6051331 (2000-04-01), Spear et al.
patent: 2004/0003455 (2004-01-01), Tonovich et al.
patent: 2004/0019140 (2004-01-01), Saldana et al.

Affiliated with

Also associated with

Rating

Diffusion bonding method for microchannel plates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Diffusion bonding method for microchannel plates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Diffusion bonding method for microchannel plates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3382723