Method of forming substrate for fluid ejection device

Details Method of forming substrate for fluid ejection device Method of forming substrate for fluid ejection device

2005-05-17

2005-05-17

Mills, Gregory (Department: 1763)

Etching a substrate: processes

Forming or treating thermal ink jet article

C216S002000, C438S021000, C029S890100

Reexamination Certificate

active

06893577

ABSTRACT:
A method of forming an opening through a substrate having a first side and a second side opposite the first side includes extending spaced etch stops into the substrate from the first side, etching into the substrate between the spaced etch stops, and etching into the substrate from the second side toward the first side to the spaced etch stops. Etching into the substrate between the spaced etch stops includes forming a first portion of the opening and etching into the substrate to the spaced etch stops includes forming a second portion of the opening.

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