Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-05-03
2005-05-03
Tucker, Philip C. (Department: 1712)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S004000, C428S413000, C428S414000, C523S400000, C525S530000, C525S533000, C549S001000, C549S200000, C549S356000, C549S472000, C549S512000
Reexamination Certificate
active
06887737
ABSTRACT:
This invention relates to epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, thermosetting resin compositions based on such epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, reaction products of which are controllably degradable when subjected to appropriate conditions.
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Tishkoff Rebecca L.
Torres-Filho Afranio
Wang Jianzhao
Woods John G.
Yaeger Erin K.
Bauman Steven C.
Feely Michael J.
Henkel Corporation
Tucker Philip C.
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