Method of making a multilayer inductor

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S592100, C029S841000, C029S851000, C252S514000, C336S200000, C336S223000, C336S232000, C427S096400, C427S126300, C427S376200, C228S248100, C228S248500

Reexamination Certificate

active

06839955

ABSTRACT:
In the multilayer inductor, the substrate thereof is composed of a constituent belonging to spinel ferrite, and is furnished with internal conductors of a main constituent being silver at the interior of the substrate. The internal conductors are drawn outside of the substrate, and the drawn portions are provided with external electrodes. The internal conductors contain manganese and bismuth, and the manganese and bismuth contents at an interface between the internal conductors and the substrate are more than those of other ranges. MnO2of 0.02 to 0.1 wt % and Bi2O3of 0.5 to 1.2 wt % are added to a paste of the main constituent being silver to be used to the internal conductors, and the paste is baked together with spinel ferrite material.

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“Polymeric conductive pastes as solder replacement for flip-chip attachment”; Maner, K.U.; Ang, S.S.; Schaper, L.W.; Brown, W.D.; IEEE Transactions on vol.: 21, Issue: pp.:382-393.*
“A technology for high density mounting utilizing polymeric multilayer substrate”; Takeuchi, M.; Yoshida, K.; Iida, A.; Ohdaira, H Electronic Manufacturing Technology Symposium; Apr. 26-28, 1989; pp.: 136-140.

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