Package for electronic parts, lid thereof, material for the...

Details Package for electronic parts, lid thereof, material for the... Package for electronic parts, lid thereof, material for the...

2005-07-26

2005-07-26

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S703000, C257S712000, C257S711000, C257S720000, C257S741000, C257S747000, C257S706000, C257S675000, C257S765000, C257S743000, C257S744000

Reexamination Certificate

active

06921970

ABSTRACT:
A lid material (1) according to the present invention comprises: a base layer (2) composed of a low thermal expansion metal; an intermediate metal layer (3) provided on one surface of the base layer (2) and composed of a low proof stress metal having a proof stress of not greater than 110 N/mm2; and a brazing material layer (4) provided on the intermediate metal layer (3) and composed of a silver brazing alloy mainly comprising silver. The intermediate metal layer (3) and the brazing material layer (4) are press- and diffusion-bonded to each other, and the brazing material layer (4) has a blistered area ratio of not greater than 0.5% as observed on an outer surface of the brazing material layer. The low proof stress metal is preferably oxygen-free copper. A lid produced from the lid material (1) exhibits an excellent bonding property when the lid is brazed to a case mainly composed of a ceramic material for an electronic component package. Further, the lid suppresses the breakage of the case, and ensures excellent brazing workability.

REFERENCES:
patent: 5814880 (1998-09-01), Costello et al.
patent: 0 989 605 (2000-03-01), None
patent: 0989605 (2000-03-01), None
patent: 03-283549 (1991-12-01), None
patent: 2000-003973 (2000-01-01), None
patent: 2000-150687 (2000-05-01), None
patent: 2000-150689 (2000-05-01), None
patent: 2000-164746 (2000-06-01), None
patent: 2000-211055 (2000-08-01), None

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