Subaperture chemical mechanical planarization with polishing...

Details Subaperture chemical mechanical planarization with polishing... Subaperture chemical mechanical planarization with polishing...

2005-09-20

2005-09-20

Rose, Robert A. (Department: 3723)

Abrading

Abrading process

With tool treating or forming

C451S443000, C451S072000

Reexamination Certificate

active

06945856

ABSTRACT:
Embodiments of the present invention are directed to polishing an object with polishing pad conditioning. In one embodiment, a method for polishing an object comprises placing a contact portion of a polishing pad in contact with a target surface of the object to be planarized over a contact area which is smaller in area than the target surface; conditioning a noncontact portion of the polishing pad which is not in contact with the target surface of the object; and moving the polishing pad relative to the target surface of the object to move the noncontact portion in contact with the target surface of the object and move the contact portion out of contact with the target surface of the object.

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patent: 6402588 (2002-06-01), Matsuo et al.
IBM Research Disclosure Bulletin No. 32227, Pad Conditioning to Control Radial Uniformity of Mechanical Polishing, Feb. 1991.

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