Metal treatment – Stock
Reexamination Certificate
2005-01-04
2005-01-04
Ip, Sikyin (Department: 1742)
Metal treatment
Stock
C420S557000, C420S560000, C420S561000, C420S562000
Reexamination Certificate
active
06837947
ABSTRACT:
This invention discloses a lead-free Sn—Zn—Al—Ag solder alloy, which is composed of 7-10 wt % of Zn, up to 0.5 wt % of Al, up to 4.0 wt % of Ag, and the balance of Sn; and a lead-free Sn—Zn—Al—Ag—Ga solder alloy, which is composed of 7-10 wt % of Zn, up to 0.5 wt % of Al, up to 4.0 wt % of Ag, up to 4.0 wt % of Ga; and the balance of Sn. The lead-free solder alloys of the present invention have better tensile strength and elongation than the conventional Sn—Pb solder alloys. In addition, the lead-free solder alloys of the present invention have a melting point lower than 200° C., which is close to the 183.5° C. of an eutectic Sn—Pb alloy.
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D.L. Smith and H. J. Caul,Alloys of Gallium With Powdered Metals As Possible Replacement For Dental Amalgum, Journal American Dental Association, vol. 53, pp 315-324, 1956.
S.K. Bhattacharya and D.F. Baldwin,Gallium Alloy Breakthrough For Via-Filling Application, Advance Packaging, Sep. 2000, pp 61-64.
Chen Kang-I
Cheng Shou-Chang
Huang Jia-Wei
Lin Kwang-Lung
Bacon & Thomas
Ip Sikyin
National Cheng-Kung University
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