Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2005-05-24
2005-05-24
Arbes, Carl J. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S846000, C257S079000, C257S088000, C438S022000, C438S023000
Reexamination Certificate
active
06895667
ABSTRACT:
Methods for patterning a metal over a substrate and devices formed using the methods are disclosed. A patterned die having at least one raised portion and having a metal layer over the die is pressed onto a thin metal film over a substrate, such that the metal layer over the raised portion of the patterned die contacts portions of the thin metal film. Pressure is then applied such that the metal layer and the thin metal film cold-weld to one another. The patterned die is removed, such that the portions of the metal layer cold-welded to the thin metal film break away from the die and remain cold-welded to the thin metal film over the substrate, in substantially the same pattern as the patterned die.
REFERENCES:
patent: 5641611 (1997-06-01), Shieh et al.
patent: 5707745 (1998-01-01), Forrest et al.
patent: 5900160 (1999-05-01), Whitesides et al.
patent: 5925259 (1999-07-01), Biebuyck et al.
patent: 5998803 (1999-12-01), Forrest et al.
patent: 6013538 (2000-01-01), Burrows et al.
patent: 6027630 (2000-02-01), Cohen
patent: 6214631 (2001-04-01), Burrows et al.
patent: 6294398 (2001-09-01), Kim et al.
patent: 9619792 (1996-06-01), None
patent: 9828946 (1998-07-01), None
Kim et al., “Micropatterning of Organic Electronic Devices by Cold-Welding”,Science, vol. 288, pp. 831-833, May 5, 2000.
Stutzmann, et al., “Patterning of polymer-supported metal films by microcutting”,Nature, vol. 407, pp. 613-616, Oct. 5, 2000.
P.W.M. Blom et al., “Efficiency and stability of polymer light-emitting diodes”,Journals of Materials Science Materials in Electronics, vol. 11, No. 2, Mar. 2000, pp. 105-109.
Y. Xia, et al.,Unconventional Methods for Fabricating and Patterning Nanostructures, Chem. Rev. 99:7, pp. 1823-1848 (1999).
Forrest Stephen R.
Kim Changsoon
Kenyon & Kenyon
The Trustees of Princeton University
LandOfFree
Transfer of patterned metal by cold-welding does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Transfer of patterned metal by cold-welding, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Transfer of patterned metal by cold-welding will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3373924