Thermal processing system and methods for forming low-k...

Coating processes – Electrical product produced

Reexamination Certificate

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Details

C427S240000, C427S372200, C427S374100, C427S379000, C427S385500, C427S398400, C427S350000

Reexamination Certificate

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06838115

ABSTRACT:
Single wafer processing methods and systems for manufacturing films having low-k properties and low indices of refraction. The methods incorporate a processing station in which both curing and post-cure, in situ gas cooling take place.

REFERENCES:
patent: 5462603 (1995-10-01), Murakami
patent: 5620560 (1997-04-01), Akimoto et al.
patent: 5772770 (1998-06-01), Suda et al.
patent: 5884009 (1999-03-01), Okase
patent: 5968691 (1999-10-01), Yoshioka et al.
patent: 6002109 (1999-12-01), Johnsgard et al.
patent: 6015594 (2000-01-01), Yoshikawa
patent: 6042994 (2000-03-01), Yang et al.
patent: 6072163 (2000-06-01), Armstrong et al.
patent: 6198074 (2001-03-01), Savas
patent: 6215106 (2001-04-01), Boas et al.
patent: 6307184 (2001-10-01), Womack et al.
patent: 0 843 347 (1998-05-01), None
patent: 5-5326453 (1993-12-01), None
patent: 8-8310896 (1996-11-01), None
patent: 10-233370 (1998-09-01), None

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