Method and apparatus for manufacturing semiconductor apparatus

Details Method and apparatus for manufacturing semiconductor apparatus Method and apparatus for manufacturing semiconductor apparatus

2005-09-06

2005-09-06

Haran, John T. (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S309900, C156S322000, C427S541000

Reexamination Certificate

active

06939429

ABSTRACT:
A manufacturing line has a feeder for feeding a hoop substrate, a bake oven for heating and drying the fed hoop substrate, a die bonding device for applying an adhesive to a predetermined position on the dried substrate to mount an IC chip, and a cure oven for bonding the IC chip to the hoop substrate by heating and curing the adhesive.

REFERENCES:
patent: 6077382 (2000-06-01), Watanabe
patent: 6722412 (2004-04-01), Huang et al.

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