Plating method and apparatus for controlling deposition on...

Details Plating method and apparatus for controlling deposition on... Plating method and apparatus for controlling deposition on...

2005-07-26

2005-07-26

Wong, Edna (Department: 1753)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C427S098300, C427S299000, C205S118000, C205S123000, C205S210000, C205S104000, C205S291000, C205S117000, C205S102000, C205S222000

Reexamination Certificate

active

06921551

ABSTRACT:
The present invention relates to methods and apparatus for plating a conductive material on a workpiece surface in a highly desirable manner. Using a workpiece-surface-influencing device, such as a mask or sweeper, that preferentially contacts the top surface of the workpiece, relative movement between the workpiece and the workpiece-surface-influencing device is established so that an additive in the electrolyte solution disposed on the workpiece and which is adsorbed onto the top surface is removed or otherwise its amount or concentration changed with respect to the additive on the cavity surface of the workpiece. Plating of the conductive material can place prior to, during and after usage of the workpiece-surface-influencing device, particularly after the workpiece surface influencing device no longer contacts any portion of the top surface of the workpiece, to achieve desirable semiconductor structures.

REFERENCES:
patent: 4080513 (1978-03-01), Cuneo et al.
patent: 6176992 (2001-01-01), Talieh
patent: 6270646 (2001-08-01), Walton et al.
patent: 6534116 (2003-03-01), Basol
patent: 2001/0015321 (2001-08-01), Reid et al.
patent: 2001-291954 (2001-10-01), None

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