Semiconductor package having one or more die stacked on a...

Details Semiconductor package having one or more die stacked on a... Semiconductor package having one or more die stacked on a...

2005-09-20

2005-09-20

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S127000

Reexamination Certificate

active

06946323

ABSTRACT:
A semiconductor package and method for producing the same has a substrate. A prepackaged semiconductor device is coupled to the substrate. At least one die is coupled to a top surface of the prepackaged semiconductor device. An adhesive layer is laid between the prepackaged semiconductor device and the first die to coupled the two together. A mold compound is then used to encapsulate the semiconductor package.

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“Stacked Module Package (SMP): A Novel IC Package for Products with Mixed Logic and Memory Die” ChipPAC, Incorporated and Qualcomm CDMA Technologies, Mar. 2, 2004.

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