Interconnect module with reduced power distribution impedance

Details Interconnect module with reduced power distribution impedance Interconnect module with reduced power distribution impedance

2005-01-25

2005-01-25

Vigushin, John B. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S762000, C361S793000, C361S795000, C174S255000, C174S257000, C174S258000, C174S260000, C174S262000, C257S691000, C029S832000, C029S846000, C029S852000

Reexamination Certificate

active

06847527

ABSTRACT:
An interconnect module for an integrated circuit chip incorporates a thin, high dielectric constant embedded capacitor structure to provide reduced power distribution impedance, and thereby promote higher frequency operation. The interconnect module is capable of reliably attaching an integrated circuit chip to a printed wiring board via solder ball connections, while providing reduced power distribution impedance of less than or equal to approximately 0.60 ohms at operating frequencies in excess of 1.0 gigahertz.

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