Method of manufacturing monolithic ceramic electronic part...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

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C156S089120, C156S089140, C361S321300, C428S210000

Reexamination Certificate

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06884308

ABSTRACT:
In manufacturing a monolithic ceramic electronic part, an oxide of a conductive metal component contained in internal electrodes is mixed with a ceramic green sheet used for forming a ceramic layer by burning. Therefore, even if the conductive metal component diffuses and dissolves from the internal electrodes, the occurrence of non-uniformity in the concentration of the oxide of the conductive metal component is suppressed over the entire region of a laminate, and thus the entire laminate can be sufficiently uniformly sintered.

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patent: 20010006928 (2001-07-01), Masuda
patent: 20020013213 (2002-01-01), Sato et al.
patent: 0 043 157 (1982-01-01), None
patent: 0 737 655 (1996-10-01), None
patent: 3-112861 (1991-05-01), None
patent: 04-225208 (1992-08-01), None
Korean Office Action issued Sep. 8, 2004.

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