Heat exchange – Conduit within – or conforming to – panel or wall structure – Wall forms enclosure
Reexamination Certificate
2001-06-27
2004-06-22
Bennett, Henry (Department: 3743)
Heat exchange
Conduit within, or conforming to, panel or wall structure
Wall forms enclosure
C165S168000, C165S170000, C165S046000, C165S056000, C165S171000
Reexamination Certificate
active
06752203
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to a thermal control system employing an air circulation panel. More specifically, the invention relates to a device used to thermally control a room indirectly by circulating a temperature controlled fluid in a specially designed hollow chamber in a panel forming a portion of the room surface.
2. Description of the Related Art
There are several types of floor heating systems sometimes called radiant floor heating systems. One type disposes piping under a floor and then circulates a warm treated water in the piping, thereby warming the floor and thereafter the room. A second type disposes an electrical heater cable in the piping instead of warm water. These conventional systems may have installation or economic advantages, but their construction and maintenance is quite expensive. Further these conventional systems may have additional safety and maintenance risks.
Specifically, the warm treated water frequently contains ethylene glycol, a hazardous material when liquid. If the pipes leak, not only will the water cause severe structural damage, but the cleanup may be dangerous. Further, the water pipes are frequently encased in a liquid castable for support and to provide a flat floor. The use of such a castable is expensive and messy and prevents easy repair should the pipes leak and prevents use of this system on overhead or wall surfaces. Additionally, this type of conventional system is not used to cool and so is of limited use in changing residential climates.
Further, the electrical heater cable in piping may have an electrical short which is difficult to find and repair without removal of the entire pipe. The pipes holding the electrical heater cables are also frequently encased in a castable providing the same undesirable problems and risks stated above.
Applicant's have previously provided a simplified air circulation panel for cooling or heating a room. This simplified invention is disclosed in Applicant's Japanese patent application SN 11-348877.
In this apparatus a simplified air circulation panel employs a feeding pump to circulate warm or cool air into the interior of a panel on a room surface. The invention provide beneficial construction and maintenance costs compared with the above types but there were several undesirable disadvantages. One disadvantage was that heat conductivity of the structure was low and it took too much time to warm the floor or wall. A second disadvantage was that the expected cost savings were not realized since the operational time was extended. In sum, more improvements were required to reduce the energy costs and to ensure an easily maintained constant room temperature at low costs with easy construction and increased safety.
OBJECTS AND SUMMARY OF THE INVENTION
It is an object of the present invention to provide an air circulation panel that surmounts the forgoing undesirable properties.
It is another object of the present invention to provide an air circulation panel for a room which quickly circulates air in a piping apparatus along an interior surface of the room where the surface can be either a ceiling, floor, or wall.
It is another object of the present invention to provide an air circulation apparatus that may be easily integrated into floor, wall, or ceiling coverings.
It is another object of the present invention to provide an air circulation apparatus that easily maintains a constant temperature while reducing energy consumption.
It is another object of the present invention to provide an air circulation apparatus that reduces an environmental impact of the apparatus by reducing energy consumption and prevents the use of hazardous materials like ethylene glycol and minimizes fire risks from electrical failures.
Briefly stated, the present invention provides a thermal control system including an air colliding chamber bounded by at least a conducting board and an insulating panel. An air jet pipe and an air jet suction pipe extend into the air colliding chamber. Thermally adjusted air is urged into each air jet pipe, and out at least one air jet hole, into the air colliding chamber. In the air colliding chamber, air vortices repeatedly contact the conducting board and thermal transfer occurs. Return air is urged into each air suction pipe through at least one jet suction hole for return and thermal adjustment.
According to one embodiment of the present invention there is provided a thermal control apparatus, comprising: a conducting board, an insulating panel, an air colliding chamber bounded by at least the conducting board, and the insulating panel, at least one air supply pipe and at least one air return pipe in the air colliding chamber, the air supply pipe having at least a first air jet hole, the air return pipe having at least a first air jet suction hole, and first means for urging thermally adjusted air into the air supply pipe and out the at least first air jet hole effective to form a plurality of vortices within the air colliding chamber which causes a thermal exchange between the thermally adjusted air and the conducting board whereby the conducting board is changed in temperature.
According to another embodiment of the present invention there is provided a thermal control apparatus, wherein: the first means for urging includes a second means for urging return air into the at least one air jet suction hole and the air return pipe effective to promote the plurality of vortices whereby the thermal exchange is maximized and made more efficient.
According to another embodiment of the present invention there is provided a thermal control apparatus, further comprising: at least one supply pipe on the at least one air supply pipe distal the at least first air jet hole, the first means for urging includes a feeding pump on a proximate end of the supply pipe opposite the air supply pipe, at least one return pipe on the at least one air return pipe distal the at least first air jet suction hole, the second means for urging includes a suction pump on a proximate end of the supply pipe opposite the return pipe, and means for producing the thermally adjusted air joining the feeding pump and the suction pump effective to supply the thermally adjusted air to the feeding pump and accept the return air from the return pipe whereby thermal control of the conducting board is simplified.
According to another embodiment of the present invention there is provided a thermal control apparatus, further comprising: a plurality of air jet suction holes on a first end of the at least first air return pipe at a separation, in a direction, and at a position effective to maximize vortices thermal transfer to the conducting board, a plurality of air jet holes on a first end of the at least first air supply pipe at a separation, in a direction, and at a position effective to maximize vortices and thermal transfer to the conducting board, a first and a second side wall joining the conducting board and the insulating panel, and the first and the second side walls having a separation, at a height, and in a position effective to maximize the vortices in the air colliding chamber.
According to another embodiment of the present invention there is provided a thermal control apparatus, further comprising: at least a first and a second air colliding chambers connected in series along the conducting board, the air supply pipe and the air return pipe in each the chamber connecting in parallel to the supply pipe and the return pipe, and the conducting board extending on a first surface of each the air colliding chamber effective to maximize efficient thermal transfer from each the at least first and the second chamber.
According to another embodiment of the present invention there is provided a thermal control apparatus, wherein: the insulating panel includes a recess opposite each the air colliding chamber, and the recess having a shape and a position effective to receive and support the air supply pipe and the air return pipe and maximize efficient thermal transfer to
Bennett Henry
Kurita Kogyo Co., Ltd.
Patel Nihir
LandOfFree
Cooling and heating system and air circulation panel does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cooling and heating system and air circulation panel, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling and heating system and air circulation panel will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3353170