Method and apparatus for cooling an electronic component

Details Method and apparatus for cooling an electronic component Method and apparatus for cooling an electronic component

2003-02-14

2004-08-03

Chérvinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S703000, C361S707000, C361S708000, C361S709000, C361S710000, C257S706000, C257S714000, C165S080300, C165S080400, C165S104260, C165S185000, C174S015200, C174S016300

Reexamination Certificate

active

06771508

ABSTRACT:

FIELD OF THE INVENTION
This invention relates to mobile computing systems. In particular, it relates to a thermal management solution for such systems.
BACKGROUND
Mobile computing systems, such as notebook or laptop computers, and pen-based computing systems (Tablet PC's) generally comprise a large number of electronic components housed within an enclosure that has a comparatively small form factor.
These electronic components generate significant quantities of heat during operation. Therefore, there is a need for some thermal management solution to dissipate the heat in an efficient manner so that the components may operate normally.
Existing thermal management solutions generally include a heat sink comprising a plurality of cooling fins which are physically mounted to a heat generating component that requires cooling. The heat sink is of a conductive material and draws heat from the heat generating component by conduction where after it radiates the heat through the cooling fins.
The above describe a thermal management solution and requires the heat generating component to have sufficient surface area to permit the mounting of the heat sink thereon. However, in some cases a heat generating component may lack the required surface area to permit such a mounting, thereby rendering said thermal management solution in inutile.
This can be a problem, particularly where there is a large concentration of heat generating components that each individually lack the surface dimension to permit mounting of a heat sink thereon.


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