Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2002-11-20
2004-10-19
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S699000, C361S707000, C361S709000, C257S714000, C257S715000, C257S722000, C174S015100, C174S015200, C174S016100, C165S080300, C165S080100, C165S185000
Reexamination Certificate
active
06807058
ABSTRACT:
FIELD AND BACKGROUND OF INVENTION
This invention relates to heat sinks for semiconductor packages and combinations of such a heat sink with devices from which heat must be transferred.
The generation of heat within semiconductor packages for devices such as microprocessors has long been recognized as requiring heat transfer arrangements to permit satisfactory operation of computer circuits and the like. As the technology has progressed, heat loads imposed have risen which space allowances have compressed. Thus problems arise in effectuating the necessary transfers of heat from increasingly confined spaces. Recently, heat loads from microprocessor have risen to exceed seventy five watts, while space allowances have shrunk to limit the available height for a heat sink to less than forty millimeters.
SUMMARY OF THE INVENTION
With the above problems in mind, it is a purpose of the present invention to enhance the capability of an assembly to transfer heat from a semiconductor package source while enabling reduction in the space required for effective operation. In realizing this purpose of the present invention, bodies of fins are affixed to oppositely facing surfaces of a rectilinear body which is adapted to receive heat from a semiconductor package. In a preferred form of the invention, one body of fins is on the surface which is adapted to engage the semiconductor package.
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Crippen Martin Joseph
Matteson Jason Aaron
Chervinsky Boris
Grosser George E.
International Business Machines - Corporation
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