Socket having frame for supporting thermal module

Details Socket having frame for supporting thermal module Socket having frame for supporting thermal module

2002-10-07

2004-02-24

Martin, David (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S709000, C361S818000

Reexamination Certificate

active

06697263

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to sockets for connecting electronic devices to printed circuit boards, and particularly to a socket having a frame for supporting a thermal module which is used for dissipation of heat generated from an electronic device mounted on the socket.
2. Prior Art
Developments in computer chip technology have given central processing units (CPUs) more functions and faster processing speeds. Accordingly, modern CPUs generate copious amounts of heat. Excessive heat can adversely affect operation of the computer system, and cause the system to become unstable. Therefore, a thermal module is widely used to remove heat from a CPU of a computer.
FIGS. 4 and 5
show a conventional electronic device assembly. A thermal module
80
is attached to a CPU
82
. The CPU
82
is mounted on a socket
84
. The socket
84
is mounted on a printed circuit board (PCB)
86
. A back plate
88
is mounted at an underside of the PCB
86
. A plurality of through holes (not labeled) is defined in the back plate
88
. A plurality of bolts
90
respectively extends through the through holes of the back plate
88
, the PCB
86
and the thermal module
80
. A plurality of nuts
92
respectively threadedly engages with the bolts
90
and abuts against the thermal module
80
, thereby fixing the CPU
82
to the socket
84
.
However, during assembly, the nuts
92
are prone to be over-tightened on the bolts
90
. The thermal module
80
is pressed too tightly against the CPU
82
. This frequently damages the CPU
82
or the socket
84
or both.
SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide a socket having a frame that can support a thermal module and thereby prevent the thermal module from exerting excessive force on a CPU received in the socket.
To achieve the above-mentioned object, a socket for connecting a CPU to a PCB includes a base and a frame surrounding the base. The base has a plurality of terminals received therein. A receiving space is defined between the base and the frame, for receiving the CPU therein. When the CPU is fittingly received in the receiving space of the socket, the CPU contacts the terminals. When a thermal module is placed in thermal contact with the CPU, the frame supports the thermal module. Thus the frame prevents the thermal module from causing the CPU to press too hard against the terminals.
Other objects, advantages and novel features of the present invention will be drawn from the following detailed description of a preferred embodiment of the present invention with attached drawings, in which:


REFERENCES:
patent: 5199889 (1993-04-01), McDevitt, Jr.
patent: 6198630 (2001-03-01), Cromwell
patent: 6222731 (2001-04-01), Katsui
patent: 6359783 (2002-03-01), Noble
patent: 6449157 (2002-09-01), Chu

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