Electrical component in chip structure and method for the manufa

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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Details

29856, 338324, 361306, 361405, H01G 114, H01C 114

Patent

active

049595059

ABSTRACT:
At two large opposite end faces a component composed of a wafer-shaped or lamina-shaped body (1) has coatings (2, 3) and ribbon-shaped terminal elements (5, 6) and is pressure-coated with a lamina-shaped or cuboid insulating coat (7). The terminal elements (5, 6) of the component are conducted toward the outside through the insulating coat (7) at the level of the end faces of the body (1) without being bent off, the upper terminal element (5) is bent off in a downward direction and is then bent over onto the underside (19) of the insulating coat, and the lower terminal element (6) is first bent off in an upward direction, and is then arranged at the surface of the insulating coat (7) at the level of the exit location of the first terminal element (5), is then bent over by 180.degree. at this level and, lying against the terminal element (6), is bent down under the underside (19) of the insulating coat (7).

REFERENCES:
patent: 4497012 (1985-01-01), Gottlieb et al.
patent: 4578737 (1986-03-01), Westermann
patent: 4617609 (1986-10-01), Utnet

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