Radiant energy – Photocells; circuits and apparatus – Housings
Reexamination Certificate
2001-01-16
2004-02-03
Sugarman, Scott J. (Department: 2873)
Radiant energy
Photocells; circuits and apparatus
Housings
C250S216000
Reexamination Certificate
active
06686588
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates generally to the packaging of electronic components. More particularly, the present invention relates to an optical module.
2. Description of the Related Art
Image sensors are well known to those of skill in the art. An image sensor included an active area, which was responsive to electromagnetic radiation. The image sensor was used to fabricate an image sensor assembly.
In one prior art image sensor assembly, the image sensor was located within a housing, which supported a window. Radiation passed through the window and struck the active area of the image sensor, which responded to the radiation.
To form the image sensor assembly, the image sensor was mounted to a printed circuit mother board. After the image sensor was mounted, a housing was mounted around the image sensor and to the print circuit mother board. This housing provided a seal around the image sensor, while at the same time, supported a window above the image sensor.
As the art moves to smaller and lighter weight electronic devices, it becomes increasingly important that the size of the image sensor assembly used within these electronic devices is small. The conventional image sensor assembly described above required a housing to support the window and to seal the image sensor. However, this housing was relatively bulky and, as a result, the image sensor assembly was relatively large.
SUMMARY OF THE INVENTION
In accordance with the present invention, an optical module includes a substrate having a base and a sidewall. The optical module further includes an image sensor coupled to the base and a lens housing coupled to the sidewall.
The sidewall includes a joint surface and the lens housing includes a mounting surface. The mounting surface of the lens housing is coupled to the joint surface of the substrate thus coupling the lens housing to the sidewall.
In one embodiment, the mounting surface and the joint surface are planar and are bonded together with adhesive as a butt bond. The mounting surface has a width sufficient to provide a desired level of protection, e.g., a hermetic seal, of the image sensor from the ambient environment. However, it is desirable to form the mounting surface with a minimal width to minimize the overall width of the optical module.
To minimize the overall width of the optical module, in an alternative embodiment, the mounting surface of the lens housing is formed with a locking feature. The locking feature includes a horizontal surface parallel to the joint surface of the substrate and a vertical surface perpendicular to the joint surface and extending downwards from the horizontal surface. The horizontal surface is bonded to the joint surface and the vertical surface is bonded to an interior surface of the sidewall.
Advantageously, to enter into optical module
100
, dust and moisture is forced to travel horizontally along the interface distance of the horizontal surface and, in addition, is forced to travel vertically along the interface distance of the vertical surface. By forming a relatively long and tortuous interface between the lens housing and the substrate, the environmental protection of the optical module is enhanced. Further, by forming part of this interface in the vertical direction, this enhanced environmental protection is obtained without a corresponding increase in width of the optical module.
As a further advantage, by bonding the vertical surface of the mounting surface of the lens housing to the interior surface of the sidewall of the substrate, the strength of the bond between the lens housing and the substrate is greatly increased compared to the strength of a butt bond. By increasing the strength of the bond between the lens housing and the substrate, the reliability of the optical module is insured.
In an alternative embodiment, the joint surface is formed with a locking feature similar to that described above for the mounting surface. Forming the joint surface as a locking feature enhances the environmental protection as well as reliability of the optical module while at the same time minimizes the overall width of the optical module.
Also in accordance with the present invention, a method of forming an optical module includes coupling an image sensor to a base of a substrate. A lens housing is coupled to a sidewall of the substrate.
To couple the lens housing, a mounting surface of the lens housing is aligned with a joint surface of the substrate. The mounting surface of the lens housing is bonded to the joint surface of the sidewall thus mounting the lens housing to the substrate. In one embodiment, the mounting surface is bonded to the joint surface by a butt bond.
In an alternative embodiment, the mounting surface includes a locking feature. A horizontal surface of the mounting surface is bonded to the joint surface and a vertical surface of the mounting surface is bonded to an interior surface of the sidewall.
In yet another alternative embodiment, the joint surface includes a locking feature. A horizontal surface of the joint surface is bonded to the mounting surface of the lens housing and a vertical surface of the joint surface is bonded to an exterior side surface of the lens housing.
By forming either the mounting surface or the joint surface as a locking feature, the environmental protection as well as reliability of the optical module is enhanced while at the same time the overall width of the optical module is minimized.
To minimize the cost associated with fabricating the optical module, in one embodiment, a plurality of optical modules are fabricated simultaneously in an array from an image sensor substrate comprising a plurality of substrates integrally connected together. Advantageously, the optical modules are tested for validity while still in an array, which is less labor intensive and thus lower cost than testing each optical module on an individual basis. The image sensor substrate is then singulated, e.g., by mechanical snapping, thus forming a plurality of optical modules.
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Glenn Thomas P.
Hollaway Roy Dale
Webster Steven
Amkor Technology Inc.
Gunnison McKay & Hodgson, L.L.P.
Hanig Richard
Hodgson Serge J.
Sugarman Scott J.
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