Method for manufacturing ceramic multi-layered board

Details Method for manufacturing ceramic multi-layered board Method for manufacturing ceramic multi-layered board

2003-02-11

2004-11-02

Mayes, Melvin C. (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S089160, C156S089230

Reexamination Certificate

active

06811634

ABSTRACT:

TECHNICAL FIELD
The present invention relates to a method of manufacturing ceramic multi-layer boards to be used as a small component of personal computers and cellular phones.
BACKGROUND ART
A conventional ceramic multi-layer board is disclosed in, e.g., Japanese Patent Application Non-Examined Publication No. H11-220260.
FIG. 11
illustrates the ceramic multi-layer board disclosed in the foregoing publication. This board is manufactured by a conventional method of laminating green-sheets.
As shown in FIG.
11
(
a
), conductive patterns
13
,
14
are printed on each green sheet
12
. Then as shown in FIG.
11
(
b
), respective green sheets
12
are laminated, and undergo a bonding process by heat & pressure to be integrated. The integrated product is then fired. In this conventional method; however, the shrinkage due to debindering and firing occurs in the product shown in FIG.
11
(
b
). This shrinkage occurs in both a thickness direction and an in-plane direction of the multi-layer board. The shrinkage along the in-plane direction, in particular, influences dimensions of the conductive patterns. Dispersion due to this firing shrinkage is approx. 0.2%. To be more specific, when a board is sized 50 mm square, a dimensional accuracy (dispersion) of the conductive patterns falls within a range of ±100 &mgr;m.
Under the present circumstances, boards are mounted with components at a higher density, and a bonding pad is required to have a narrower pitch (not more than 150 &mgr;m). Thus the conventional method of laminating green-sheets invites short-circuits in the inner conductive patterns, and it is hard to manufacture electronic components of desirable performance by this conventional method.
DISCLOSURE OF INVENTION
A method of manufacturing ceramic multi-layer boards is disclosed. The method including the steps of:
forming a adhesive layer on at least one surface of a ceramic board;
forming conductive patterns on the adhesive layer;
providing green sheet (GS) on top of the conductive patterns by applying heat and pressure;
forming conductive patterns on the GS;
laminating conductive patterns and GS one after another more than once; and
firing the laminated ceramic board thus formed and undergone a debindering process.


REFERENCES:
patent: 4799984 (1989-01-01), Rellick
patent: 4806188 (1989-02-01), Rellick
patent: 5006182 (1991-04-01), Gantzhorn et al.
patent: 5300163 (1994-04-01), Ohtaki
patent: 5609704 (1997-03-01), Hayama et al.
patent: 0 405 947 (1991-01-01), None
patent: 5-238853 (1993-09-01), None
patent: 11-121645 (1999-04-01), None
patent: 11-135946 (1999-05-01), None
patent: 11-220260 (1999-08-01), None
patent: 2000-183503 (2000-06-01), None
patent: 2001-15916 (2001-01-01), None

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