Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...
Reexamination Certificate
2002-11-20
2004-10-26
Peng, Kuo-Liang (Department: 1712)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Mixing of two or more solid polymers; mixing of solid...
C525S474000, C524S588000, C528S025000
Reexamination Certificate
active
06809155
ABSTRACT:
FIELD OF THE INVENTION
This invention relates to compounds and resins containing at least one double bond, electron donor or electron acceptor functionality, and silane functionality for use in semiconductor packages.
BACKGROUND OF THE INVENTION
Adhesive compositions are used in many industries, such as the microelectronics industry, where good adhesion to metal and organic substrates and low viscosity for easy dispensability are important requisites.
Adhesion to metal and organic substrates is not always easily achievable, and the addition of silane adhesion promoters to adhesive formulations is one means of correcting this deficiency. Commonly used and commercially available silanes are small molecules that tend to volatilize significantly before the cure temperature of the adhesive is reached. Because silanes tend to be subject to hydrolysis, the addition of higher amounts of the silanes to offset the volatility could lead in turn to the presence of moisture in the adhesive compositions. This could be a problem in many applications. With reference to microelectronic devices, moisture creates the potential, through corrosion of circuits or voiding of the moisture and delamination of device packaging, for eventual failure of the device.
As a solution to these problems this specification discloses adhesion promoting resins with sufficient molecular weight to give lower volatility than the silanes currently commercially available.
SUMMARY OF THE INVENTION
This invention is a curable compound or resin or both (hereinafter, “compound” or “resin” shall mean “compound or resin or both”) that contains an oligomeric or polymeric segment, a silane segment, and electron donor or electron acceptor functionality. In one embodiment, the resin is formulated into a die attach adhesive, which further contains a conductive or nonconductive filler, and optionally, an initiator.
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Gennaro Jane E.
National Starch and Chemical Investment Holding Corporation
Peng Kuo-Liang
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