Integrated electro-optical package and method of fabrication

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – Plural light emitting devices

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257 80, 257 82, H10L 3300

Patent

active

057082804

ABSTRACT:
An integrated electro-optical package including a dual sided opto-electronic device, composed of a substrate with an array of light emitting devices (LEDs) formed on a first major surface thereof, and at least one vertical cavity surface emitting laser formed on an opposed second major surface of the substrate. A mounting structure formed so as to allow for the mounting of the dual sided opto-electronic device on the interior major surfaces, and further having electrical conductors for cooperating with the LEDs and VCSEL of the opto-electronic device. A driver substrate having electrical connections for interfacing with the mounting structure and the dual sided opto-electronic device. A plurality of driver circuits connected to the mounting structure and dual sided opto-electronic device through connection pads formed on the driver substrate.

REFERENCES:
patent: 4626878 (1986-12-01), Kuwano et al.
patent: 5034092 (1991-07-01), Lebby et al.
patent: 5105238 (1992-04-01), Nikaido et al.
patent: 5449926 (1995-09-01), Holm et al.

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