Split fin heat sink

Details Split fin heat sink Split fin heat sink

2003-03-13

2004-03-30

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C165S185000, C174S016300, C257S706000, C257S722000

Reexamination Certificate

active

06714415

ABSTRACT:

BACKGROUND
It is known in electronic equipment to provide a heat sink that is thermally coupled to an electronic component such as a microprocessor to prevent the electronic component from overheating. It has been proposed to form heat sinks having a central core and a large number of straight or curved fins that extend outwardly from the core.
It may be expected that continued development of microprocessors or other electronic components may increase the demands on heat sinks and may make more efficient heat sinks particularly desirable.


REFERENCES:
patent: 5597034 (1997-01-01), Barker et al.
patent: 5661638 (1997-08-01), Mira
patent: 6367542 (2002-04-01), Chen
patent: 6404634 (2002-06-01), Mann
patent: D464939 (2002-10-01), Chuang et al.
patent: 6466444 (2002-10-01), Cheung
patent: 6487077 (2002-11-01), Lin
patent: 6505680 (2003-01-01), Hegde
patent: 6543522 (2003-04-01), Hegde
patent: 6575231 (2003-06-01), Wu
patent: D476958 (2003-07-01), Tsai

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