Die-bonding method of pellets

Details Die-bonding method of pellets Die-bonding method of pellets

1989-12-11

1990-09-25

Heinrich, Sam

Metal fusion bonding

Process

Preplacing solid filler

228123, 228 41, 156 91, 156281, 156325, 29832, B23K 37047, H05K 334

Patent

active

049587641

ABSTRACT:
A die-bonding method of pellets, which includes a first step for causing a first paste to adhere to a forward end of a needle, a second step for lowering the needle from above a pellet located at a first position so as to cause the first paste stuck to the forward end of the needle at the first step, to adhere to the upper portion of the pellet, and also, to displace the pellet in a state where the pellet is held at the forward end of the needle by an adhesive force of the first paste, a third step for lowering the lower portion of the pellet held by the first paste at the forward end of the needle, onto a predetermined portion of a frame applied with a second paste, and a fourth step for raising the needle after the third step.

REFERENCES:
patent: 4396140 (1983-08-01), Jaffe et al.
IBM Technical Disclosure Bulletin, "Selective Molten Solder Applicator for Arrays", vol. 32, No. 7, pp. 180, 181, Dec. 1989.
IBM Technical Disclosure Bulletin, "Mechanically Controlled Thermal Joining", vol. 32, No. 8A, pp. 164, 165, Jan. 1990.

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