Light emitting device package

Details Light emitting device package Light emitting device package

2001-07-30

2004-03-02

Coleman, W. David (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

C257S080000, C257S082000, C257S088000, C257S098000, C257S432000, C257S433000

Reexamination Certificate

active

06700136

ABSTRACT:

BACKGROUND OF INVENTION
The invention relates generally to light emitting devices (LEDs) and more particularly to packaging of light emitting devices. It would be desirable to provide a quick and inexpensive method for fabricating flexible LED packages.
SUMMARY OF INVENTION
Briefly, in accordance with one embodiment of the present invention, A flexible light emitting device (LED) package comprises: a thermally conductive layer; an electrically insulating layer having openings extending therethrough; LEDs situated within the openings of the electrically insulating layer and including contact pads; and electrically conductive strips attached to the contact pads and the electrically insulating layer.


REFERENCES:
patent: 5886401 (1999-03-01), Liu
patent: 2002/0123163 (2002-09-01), Fujii
U.S. patent application Ser. No. 09/681,599 Filed May 4, 2001, Entitled “Surface Mount Light Emitting Device Package and Fabrication Method”.*
U.S. patent application Ser. No. 09/654,163 filed Sep. 1, 2000, Entitled “Plastic Packaging of LED Arrays” by K.M. Durocher, et al.

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