Method for non-destructive estimation of waveguide directional c

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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156279, B32B 3100

Patent

active

051850460

ABSTRACT:
A method for estimating the size and location of couplings within a waveguide directional coupler is provided. The method is applied to a waveguide directional coupler having a main transmission waveguide connected to an auxiliary transmission waveguide by a plurality of bore hole couplings. The bore hole couplings are in the interior of the waveguide directional coupler and, therefore, are not easily measurable. The invention provides a simple and inexpensive method for measuring the size and location of the couplings without dismantling or destroying the waveguide directional coupler. The method generally includes the steps of applying a two-sided tape to a member, inserting and securing the member within the main transmission waveguide, with the two-sided tape adjacent to the bore hole couplings, pouring a fine particulate substance such as talc into the auxiliary transmission waveguide such that a portion of the talc enters the bore hole couplings and adheres to the two-sided tape, and withdrawing the member such that the size and location of the bore hole couplings can be determined by measuring the size and location of marks on the two-sided tape caused by the fine particular substance adhering to the two-sided tape. In this manner, the dimensions of the bore hole couplings within the waveguide directional coupler are easily determined without the need for dismantling or destroying the waveguide coupler, and without the need for any expensive X-ray techniques.

REFERENCES:
patent: 1568876 (1926-01-01), Campbell
patent: 2416441 (1947-02-01), Grant
patent: 2541910 (1951-02-01), Bangert
patent: 2848691 (1958-08-01), Harkless
patent: 4192176 (1980-03-01), Barringer

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