Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2002-09-27
2004-04-06
Paumen, Gary F. (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
06716037
ABSTRACT:
FIELD OF THE INVENTION
The invention relates to an electric-contact structure for an IC package, especially to a flexible electric-contact structure including a plurality of elastic conductors arranged on an IC package substrate or a circuit board to proceed an electric connection with good co-planarity between the IC package and the circuit board.
BACKGROUND OF THE INVENTION
Since long time ago, there are two ways to dispose an integrated circuit package (abbreviated as “IC package”) in a circuit board (or a main board).
One way is to directly solder the IC package firmly on the circuit board, while the other way is replaceable and capable of plugging-in and pulling-out. This kind of electric-contact IC package is usually appropriate for an IC device needed to be upgraded or renewed, or it is applied for the IC device with higher single price. When one of the circuit board or the IC device is malfunctioned or needed to be renewed, then the other element may still be kept for usage; for example, a central processing unit (abbreviated as “CPU”) of computer is a typical example.
Please refer to FIG.
1
and
FIG. 2
, which is a replaceable socket typically seen in current market. Traditionally, in order to have the objectives of both the replaceable manner and the excellent electric connection, the traditional way is to dispose a plurality of pins
111
on the IC package
11
, and a socket
13
having a plurality of pin holes
131
is also disposed on the circuit board
12
for providing the IC package
11
to be inserted in. The package way of the prior IC package II has two ways, that is, the lead frame and the ball grid array (abbreviated as “BGA”). Recently, in order to pursue the IC device with high efficiency (i.e., high heat dissipation) and high pin count, a flip chip BGA package is usually applied. Its basically constituting elements are shown as FIG.
1
. An IC chip
112
is disposed on one side surface of a substrate
113
by flip chip manner, and several solders
114
are arranged on another side surface and electrically coupled to the chip
112
through the circuit design of the substrate
113
, while the non-active surface of the other side of the chip
112
is then adhered with a heat sink
115
. Since pin
111
is not an extremely rigid object and easily distorted and damaged during the procedure of plugging-in and pulling-out, so it is uneasy to be connected firmly to the solders
114
. Therefore, in current technique, after being molded and fixed on an interposer
116
, the plural pins
111
are then welded to the solders
114
.
To provide the pin
111
of the IC package
11
according to the prior arts with a capability to be inserted in and also be pulled out, all the socket
13
according to the prior arts used today includes following elements: an inserting seat
132
bonded on the circuit board and having a plurality of inserting holes
131
, a gliding board
133
capable of being arranged and covered on the top plane of the inserting seat
132
with a linearly gliding manner, and a pulling long rod
134
arranged at the side surface of the inserting seat
132
for driving the gliding board
133
to proceed slightly gliding movement. Inside each of the pinholes
131
of the inserting seat
132
, there is a conducting metallic piece (not shown in the figure) arranged and there are solders
135
in the bottom of the pinholes
131
for being bonded and further making an electric connection to the circuit board
12
. Slightly larger openings (not shown in the figure) are arranged on the gliding board
133
in positions corresponding to the pinholes
131
. By pressing down the pulling long rod
134
that is rotated to a horizontal direction to the inserting seat
132
by taking the rod axis
136
as a rotation axis, the gliding board
133
is proceeded a slightly gliding motion to tightly insert the pins
111
of the IC package
11
into the pinholes
131
. When the IC package
11
is going to be pulled out, the pulling long rod
134
is rotated to a vertical position formed as ninety degrees to the inserting seat
132
, such that the inserting pins
111
are loosened to take out the IC package
11
.
Since the pulling long rod
134
of above socket
13
occupies too large area, so an additional space is needed for accommodating the pulling long rod
134
and the rod axis
136
thereof; such that its occupying area in the circuit board is relatively larger. Therefore, the pulling long rod
134
needs a larger range for proceeding the pivoting action, and no any other element can be arranged within the pivoting and rotating space of the pulling long rod
134
. So a limitation of space application is caused and, since the arranging position of the pulling long rod
134
is different, so the biasing gravity position causes the weight of the socket
13
unable to be distributed uniformly, such that the socket
13
will be damaged during connection because of the biasing position; invisibly. Furthermore, the cost will be increased for the relative industry, and this is an urgent problem needed to be solved immediately. And, in order to promote the industrial competition ability, this problem has to be broken-through as soon as possible.
SUMMARY OF THE INVENTION
The main objective of the invention is to provide a flexible electric-contact structure for an IC package, which applies a plurality of elastic conductors for proceeding a stable electric connection through physical contact, such that the shortcoming of the prior arts, it is easy for the applied metallic pins to damage the circuit board and increase the production cost, is overcome.
The secondary objective of the invention is to provide a flexible electric-contact structure for an IC package, which applies a plurality of elastic conductors to replace the pulling long rod and pins used in the traditional socket, such that the shortcomings of the prior arts, as complicated structure, larger occupied area, biased gravity center, and large operation space, etc., are overcome.
The further objective of the invention is to provide a flexible electric-contact structure for an IC package, which applies a positioning fastener to position and secure the IC substrate and the circuit board for reaching the functions of easy operation, position, and connection.
To achieve above objectives, the flexible electric-contact structure for an IC package according to the invention may provide an electric connection between the IC package and a circuit board disposed with at least one placing-and-fixing hole, wherein the circuit board has a plurality of connection pads arranged appropriately, and flexible electric-contact structure is comprised of an IC substrate, a plurality of elastic conductors, and at least one positioning fastener.
The IC substrate has a top plane and a bottom plane, both which are corresponding to each other, and the IC substrate may electrically connect to the circuit board. On the bottom plane, there is a plurality of soldering pads arranged in corresponding to the connection pads of the circuit board respectively and, on the top plane, at least one chip is supported.
The elastic conductor is configured as an arm having a first end plane and a second end plane, wherein the first end plane is connected to one of the soldering pads of the IC substrate, and the second end plane is formed as a free end. In another preferable embodiment of the invention, the first end plane may also be connected to one of the connection pads of the circuit board, and the second end plane is formed as a free end.
Wherein, by electrically connecting the IC substrate to the circuit board, a force is applied to press the elastic conductor for proceeding an appropriate displacement motion. And the positioning fastener physically connects both the IC substrate and the placing-and-fixing hole to each other for fixing the electric-contact positions between the IC substrate and the circuit board.
In a further preferable embodiment of the flexible electric-contact structure for an IC package according to the invention, flexible electric-c
Ho Kwun-Yao
Kung Moriss
Paumen Gary F.
Via Technologies Inc.
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