Electrodeposition of copper

Details Electrodeposition of copper Electrodeposition of copper

1975-12-24

1977-02-22

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

C25D 338

Patent

active

040090876

ABSTRACT:
This invention relates to a process and to novel compositions for electrodepositing copper from an aqueous acidic copper plating bath containing at least one member from each of the following two groups:

REFERENCES:
patent: 2742413 (1956-04-01), Cransberg et al.
patent: 3328273 (1967-06-01), Creutz et al.
patent: 3373095 (1968-03-01), Abbott

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