Semiconductor laser package including a lead frame and plastic r

Details Semiconductor laser package including a lead frame and plastic r Semiconductor laser package including a lead frame and plastic r

1996-08-05

1999-08-17

Graybill, David E.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257680, 257787, H01L 23495, H01L 2302, H01L 2328

Patent

active

059397730

ABSTRACT:
A semiconductor laser package including a laser chip mounted to a leadframe, and a plastic resin housing for encapsulating the laser chip. The laser chip composed of a vertical cavity surface emitting laser and a photodetector. The vertical cavity surface emitting laser generating an emission along a path. The leadframe being positioned a fixed distance from an emission window formed in the plastic resin housing. The laser chip mounted in precise z-axis alignment from the emission window utilizing the leadframe as a dimensional reference point, with the bump height compensating for variations in laser chip dimension. An optical element is optionally positioned in the path to reflect a portion of the emission.

REFERENCES:
patent: 5516727 (1996-05-01), Broom
patent: 5732101 (1998-03-01), Shin
patent: 5801402 (1998-09-01), Shin
patent: 5812582 (1998-09-01), Gilliland et al.
patent: 5818404 (1998-10-01), Lebby et al.
patent: 5821571 (1998-10-01), Lebby et al.

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