Package structure of an image sensor and packaging

Details Package structure of an image sensor and packaging Package structure of an image sensor and packaging

2001-01-24

2003-11-11

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S433000, C257S059000, C257S072000, C257S080000

Reexamination Certificate

active

06646316

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to a package structure of an image sensor and method for packaging the same, and in particular, to a package structure of an image sensor, which is formed by way of flip chip bonding and capable of simplifying the manufacturing processes and lowering the manufacturing costs.
2. Description of the Related Art
A general sensor is used for sensing signals, which may be optical or audio signals. The sensor of the invention is used for receiving image signals and transforming the image signals into electrical signals which are transmitted to a printed circuit board.
Referring to
FIG. 1
, a conventional image sensor includes a substrate
10
, a spacer
18
, an image sensing chip
22
, and a transparent glass
28
.
The substrate
10
is made of ceramic materials. A plurality of signal input terminals
12
and signal output terminals
14
are formed on the periphery of the substrate
10
. The signal output terminals
14
are used for electrically connecting the substrate
10
to a printed circuit board
16
.
The spacer
18
is arranged on the substrate
10
to form a chamber
20
above the substrate
10
.
The image sensing chip
22
is mounted on the substrate
10
and within the chamber
20
surrounded by the substrate
10
and the spacer
18
. The substrate
10
is electrically connected to the image sensing chip
22
by a plurality of wirings
24
that electrically connects the bonding pads
26
of the image sensing chip
22
to the signal input terminals
12
of the substrate
10
, respectively.
The transparent glass
28
is mounted on the spacer
18
so that the image sensing chip
22
can be protected and receive image or optical signals travelling through the transparent glass
28
. The image signals are then transformed into electrical signals which are to be transmitted to the signal input terminals
12
of the substrate
10
. The electrical signals are transmitted from the signal input terminals
12
of the substrate
10
to the signal output terminals
14
, and then, from the signal output terminals
14
to the printed circuit board
16
.
The above-mentioned package structure of the image sensor has a lot of elements and has a lot of complicated manufacturing processes. Moreover, since the substrate
10
is made of ceramic materials, the manufacturing costs are high. Furthermore, since the ceramic materials cannot be easily cut, the substrates
10
must be manufactured one by one, which also increases the manufacturing costs.
To solve the above-mentioned problems, it is necessary for the inventor to provide a package structure and method for an image sensor, in order to facilitate the manufacturing processes and to lower the manufacturing costs.
SUMMARY OF THE INVENTION
It is therefore an object of the invention to provide a package structure of an image sensor capable of reducing the number of package elements and lowering the package costs.
It is therefore another object of the invention to provide a method for packaging an image sensor, which is capable of simplifying and facilitating the manufacturing processes.
To achieve the above-mentioned objects, the invention is characterized in that the image sensing chip is directly packaged under the transparent layer by way of flip chip bonding. Thus, the substrate for signal transmission is no longer needed.
According to one aspect of the invention, a package structure of an image sensor is characterized in that an image sensing chip is directly packaged on a flexible circuit board by way of flip chip bonding. The package structure of an image sensor includes an image sensing chip, a flexible circuit board, and a transparent layer. A plurality of electrical circuits are formed on the image sensing chip. Each of the electrical circuits is formed with bonding pads. A flexible circuit board has an upper surface and a lower surface. Signal input terminals are formed on the lower surface and at positions corresponding to each of the bonding pads of the image sensing chip, respectively, for electrically connecting to the corresponding bonding pads of the image sensing chip. The signal input terminals are electrically connected to signal output terminals, respectively, for electrically connecting to the printed circuit board. The transparent layer is used for covering the upper surface of the flexible circuit board. The image sensing chip receives image signals via the transparent layer, transforms the image signals into electrical signals, and transmits the electrical signals from the flexible circuit board to the printed circuit board.
Thus, the manufacturing costs can be lowered and the manufacturing processes can be facilitated.


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