Integrated circuit package having an internal cavity for incorpo

Details Integrated circuit package having an internal cavity for incorpo Integrated circuit package having an internal cavity for incorpo

1990-02-12

1993-12-21

Griffin, Donald A.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

3613211, H01G 114, H01G 410

Patent

active

052725901

ABSTRACT:
A decoupling scheme is presented which is particularly well suited for use with integrated circuit packages having internal cavities for receiving an integrated circuit chip such as Pin Grid Array (PGA) packages, ceramic dual-in-line packages, ceramic flat packs and ceramic leadless chip carriers. In accordance with the present invention, a decoupling capacitor (which preferably comprises a very thin high capacitance layer made by a thick film or thin film process sandwiched between an inner and outer electrode layer) is positioned within the internal cavity of an integrated circuit package such as a PGA package and electrically connected to the IC chip within the cavity. In a particularly preferred embodiment, the decoupling capacitor has a novel configuration for improved heat transfer. This novel configuration includes a pair of parallel plate electrodes wherein the upper electrode has extended flaps which wrap around the top surface of the decoupling capacitor.

REFERENCES:
patent: 2972570 (1961-02-01), Haas et al.
patent: 4670833 (1987-06-01), Sachs
patent: 4853826 (1989-08-01), Hernandez
patent: 4918513 (1990-04-01), Kurose et al.
Multilayer Ceramic Capacitors and IC's; E. Philofsky; Electronic Engineering Jun. 1982.
Functional Testing of Decoupling Capacitors For Dynamic Rams; A. G. Martin; AVX Ceramics & Ward Parkinson; Micron Technology 1982.

Affiliated with

Also associated with

Rating

Integrated circuit package having an internal cavity for incorpo does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit package having an internal cavity for incorpo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit package having an internal cavity for incorpo will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-312725