Method for metallizing a phosphor layer

Details Method for metallizing a phosphor layer Method for metallizing a phosphor layer

1997-01-22

1999-08-17

Bell, Janyce

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156276, 1563096, 156324, 427 64, 427162, 427226, 4274071, 427404, C09K 1100, B05D 506

Patent

active

059388722

ABSTRACT:
Two embodiments of a method for metallizing a phosphor layer are presented. The key to the method is covering the phosphor with a temporary planarizing layer onto which the metallizing layer (typically aluminum) is then deposited. Once the metal layer is in place, the planarizing layer is removed (by a burning process), the metal then making good contact with the phosphor and the substrate. In the first embodiment, the dry film is located below the phosphor layer while in the second embodiment it is located above it.

REFERENCES:
patent: 5145511 (1992-09-01), Patel et al.
patent: 5256463 (1993-10-01), Osaka et al.
patent: 5344353 (1994-09-01), Jang et al.
patent: 5360630 (1994-11-01), Thomas et al.
patent: 5418075 (1995-05-01), Utsumi
patent: 5653830 (1997-08-01), Fleig

Affiliated with

Also associated with

Rating

Method for metallizing a phosphor layer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for metallizing a phosphor layer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for metallizing a phosphor layer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-311890