Stabilization for thin substrates

Details Stabilization for thin substrates Stabilization for thin substrates

2001-07-26

2003-12-09

Zarabian, Amir (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S033000, C438S464000, C438S976000

Reexamination Certificate

active

06660547

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to thin substrates used in fabricating devices. More particularly, the invention relates to reinforcements for thin substrates.
BACKGROUND OF THE INVENTION
Thin or ultra thin glass substrates have been proposed for use in fabricating devices. The thin glass substrates are particularly suitable for forming flexible devices, such as organic light emitting diodes (OLEDs).
FIG. 1
shows a conventional OLED device
100
. The OLED device comprises one or more organic functional layers
110
between first and second electrodes
105
and
115
formed on a thin substrate
101
. The electrodes can be patterned to form, for example, a plurality of OLED cells. The cells are used to form a pixelated or segmented OLED device. Bond pads
150
, which are coupled to the first and second electrodes, are provided to enable electrical connections to the OLED cells. A cap
160
encapsulates the device to protect the OLED cells from the environment such as moisture and/or air.
To manufacture thin glass substrates, a large sheet of thin glass is first fabricated. The large sheet is then cut to create substrates of the desired size. However, the cutting process may cause defects at the edges of the substrates. These defects make the substrates susceptible to cracking during and after fabrication, thus damaging the devices. This undesirably reduces yields and increase production cost.
As evidenced from the above discussion, it is desirable to provide a thin substrate which is less prone to damage during fabrication of devices.
SUMMARY OF THE INVENTION
The invention relates to reinforcements of substrates used in the fabrication of, for example, OLEDs. Such substrates, which are typically made of glass, are brittle and thus are quite susceptible to damage from handling. The reinforcement comprises a support rim at the edge of the substrate. The support rim can be located on the upper, lower, or both surfaces of the substrate. The support rim comprises epoxy, adhesives, or other types of materials which adhere to the substrate. The support rim can be formed using various techniques such as laminating, screen printing, photolithography, dip coating or roll coating.


REFERENCES:
patent: 4198263 (1980-04-01), Matsuda
patent: 5051326 (1991-09-01), Celler et al.
patent: 5723385 (1998-03-01), Shen et al.
patent: 6265820 (2001-07-01), Ghosh et al.
Burroughs et al., “Light-emitting diodes based on conjugated polymers”, Nature, London, vol. 347, 539-541, 1990, London.

Affiliated with

Also associated with

Rating

Stabilization for thin substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stabilization for thin substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stabilization for thin substrates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3113847