Electrode structure for a semiconductor device

Details Electrode structure for a semiconductor device Electrode structure for a semiconductor device

1992-07-14

1993-12-21

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257741, 257751, 257762, 257763, H01L 2348

Patent

active

052723763

ABSTRACT:
According to the present invention oxidation of Cu at wire bonding in a pad electrode using a Cu thin film as well as oxidation of Cu at wireless bonding in a bump electrode using a Cu thin film can be prevented.

REFERENCES:
patent: 4600600 (1991-07-01), Pammer et al.
patent: 4985750 (1991-01-01), Hoshino
patent: 5021300 (1991-06-01), Stacey
patent: 5068709 (1991-11-01), Egawa et al.

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