Abrading – Abrading process – Utilizing nonrigid tool
Patent
1997-08-11
1999-08-17
Scherbel, David A.
Abrading
Abrading process
Utilizing nonrigid tool
451 54, B24B 100
Patent
active
059385081
ABSTRACT:
A de-marking apparatus and method are provided for de-marking a marked packaged integrated circuit (IC). The de-marking apparatus comprises a de-marking head for removing a thin layer of material from the marked surface. The apparatus may also include mechanisms for feeding, transferring and conveying the marked ICs to and from the de-marking head, and washing, drying, and receiving the de-marked ICs in an automated fashion. The method includes physically removing package material from a marked IC surface and producing a surface reflectivity suitable for re-marking with a laser beam.
REFERENCES:
patent: 3603041 (1971-09-01), McDonald
patent: 4375025 (1983-02-01), Carlson
patent: 4513539 (1985-04-01), Steinback
patent: 4587771 (1986-05-01), Buchner et al.
patent: 4638144 (1987-01-01), Latta, Jr.
patent: 4674238 (1987-06-01), Suzuki et al.
patent: 4707722 (1987-11-01), Folk et al.
patent: 4945204 (1990-07-01), Nakamura et al.
patent: 4993588 (1991-02-01), Willberg et al.
patent: 5220754 (1993-06-01), Tayebi et al.
patent: 5335458 (1994-08-01), Stoffers et al.
patent: 5348033 (1994-09-01), Levit
patent: 5357077 (1994-10-01), Tsuruta
patent: 5551959 (1996-09-01), Martin et al.
patent: 5618227 (1997-04-01), Tsutsumi et al.
patent: 5643044 (1997-07-01), Lund
patent: 5679055 (1997-10-01), Greene et al.
patent: 5679059 (1997-10-01), Nishi et al.
patent: 5679060 (1997-10-01), Leonard et al.
Canella Robert L.
Ibarra Tony T.
Micron Electronics Inc.
Nguyen Dung Van
Scherbel David A.
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