Photolithographic masking process

Details Photolithographic masking process Photolithographic masking process

1992-11-30

1993-12-21

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437228, 430935, H01L 21469

Patent

active

052721183

ABSTRACT:
A semiconductor wafer 11 is mounted on an elongated member 18, one end of which is rotatable about a transverse axis (14), thereby to distribute a liquid on the upper surface of the wafer more evenly. In order to stabilize the rotation of the elongated member, a second elongated member is preferably attached end-to-end to the elongated member (18) and rotates with it. A counterweight (26) in the second elongated member moves during the rotation such that the distance between the wafer and the central axis and the distance between the center of the counterweight and the axis are substantially equal. The weight distribution is approximately symmetrical about the axis and the structure is dynamically stabilized. The counterweight and the wafer assembly may be moved during rotation by applying air pressure from a source (23) to pistons (13, 26) in the two elongated members.

REFERENCES:
patent: 3834613 (1974-09-01), Hankey
patent: 4267212 (1981-05-01), Sakawaki
patent: 4457259 (1984-07-01), Samuels

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