Resin-sealed chip stack type semiconductor device

Details Resin-sealed chip stack type semiconductor device Resin-sealed chip stack type semiconductor device

2001-02-13

2003-04-08

Meier, Stephen D. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S782000, C257S783000, C257S723000

Reexamination Certificate

active

06545365

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to a resin-sealed chip stack type semiconductor device in which chips are mounted one above the other thereby eliminating a space between the chips and thus realizing a dense arrangement of the chips in the device.
BACKGROUND OF THE INVENTION
FIG. 5
shows a cross-section of the conventional resin-sealed ball grided array (BGA) type of semiconductor device. Legend
11
represents a ball and there are a plurality of them. Legend
12
represents a substrate placed on the balls
11
. Legend
13
represents a chip (hereafter, first chip) mounted on the substrate
12
. Legend
14
represents a chip (hereafter, second chip) mounted above the first chip
13
. Legend
13
a
and
14
a
are the wires that connect the first chip
13
and the second chip
14
. Legend
15
represents a sealing resin which covers and protects anything and everything arranged above the substrate
12
. Filler is mixed into this sealing resin in order to enhance the thermal conductivity of the sealing resin. Thus, the conventional resin-sealed BGA type semiconductor device has a structure in which two or more chips of different sizes are stacked one above the other and the chips are incorporated in one package.
However, when the chips are stacked in this manner, there arises a problem that a short-circuit occurs between the wire
13
a
of the first chip
13
and the second chip
14
. Similarly, there arises a problem that a short-circuit occurs between the wire
13
a
of the first chip
13
and the wire
14
a
of the second chip
14
. In addition, there has been a problem that the filler mixed into the sealing resin forcefully penetrates in between the first chip
13
and the second chip
14
and damages the chips.
SUMMARY OF THE INVENTION
It is an object of this invention to obtain a resin-sealed chip stack type semiconductor device that can avoid a short-circuit between the wires and the chips, between wires, and prevent the damage of the chips due to penetration of the filler which is mixed into the sealing resin.
The resin-sealed chip stack type semiconductor device according to the present invention comprises a substrate placed on many balls, a bottom chip to which wires are connected, a top chip to which wires are connected and mounted above the bottom chip, a non-conductive bonding layer which functions to bond and fix the two chips to each other, and a sealing resin which covers and protects all the components mounted on the substrate. The non-conductive bonding layer is provided by die bonding in such a manner that is at least covers the portion of the bottom chip where the corresponding wires are connected and does not allow generation of a gap between the two chips.
Other objects and features of this invention will become apparent from the following description with reference to the accompanying drawings.


REFERENCES:
patent: 4947234 (1990-08-01), Einzinger et al.
patent: 6133637 (2000-10-01), Hikita et al.
patent: 6157074 (2000-12-01), Lee
patent: 5-226565 (1993-09-01), None
patent: 8-107178 (1996-04-01), None
patent: 8-288455 (1996-11-01), None
patent: 11-251512 (1999-09-01), None

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