Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2001-11-27
2003-09-16
Yao, Sam Chuan (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S277000, C156S293000, C101S483000, C427S554000, C427S596000
Reexamination Certificate
active
06620283
ABSTRACT:
TECHNICAL FIELD OF THE INVENTION
The invention lies in the filed of medical diagnostic procedures and devices.
BACKGROUND OF THE INVENTION
There is a need for obtaining small samples of human interstitial fluid from the skin for the purpose of analyzing this fluid for biologically relevant molecules and electrolytes that may be found therein. More particularly, there is a need for carrying out the process of releasing and collecting the interstitial fluid for glucose measurements which is useful for diabetics. The most common current techniques for obtaining body fluid for glucose measurements is done by pricking the skin with a sharp object to create a small drop of blood. This sample can then be collected and analyzed in a test kit to determine the glucose contents. The process of pricking the skin to produce fluid samples is obviously undesirable because of the pain it creates. It would be desirable to have a more painless method of collecting and releasing interstitial fluid for this and other purposes.
A method of making a carrier film is disclosed. A carrier film base member with spaced openings is supported on a flat support and loaded with meltable absorber substance from a digitally operated heated printhead of the type used for “jetting” materials, similar to an ink jet for a computer printer. Indexing of the carrier film strip or the printhead sequentially fills the openings with the absorber substance. A cover is preferably adhesively laminated over the openings containing the meltable absorber substance creating a well-like opening that has an open side from which the material will be ejected when activated by a suitable laser beam. Both the cover strip and adhesive are selected to allow the laser beam to be focused on the meltable absorber substance inside the openings. A cover strip may be made in a batch process or, for example, in a reel-to-reel continuous process using flexible film technology. The carrier material is preferably a laminated carrier film although it is conceivable that a blind opening could be produced in a film having the requisite clarity to passage of laser energy in the nature of a blind opening.
REFERENCES:
patent: 3769963 (1973-11-01), Goldman et al.
patent: 3821510 (1974-06-01), Muncheryan
patent: 3910276 (1975-10-01), Polanyi et al.
patent: 4521194 (1985-06-01), Myers et al.
patent: 4686979 (1987-08-01), Gruen et al.
patent: 4784135 (1988-11-01), Blum et al.
patent: 4818230 (1989-04-01), Myers et al.
patent: 4826431 (1989-05-01), Fujimura et al.
patent: 4940411 (1990-07-01), Vassiliadis et al.
patent: 5092864 (1992-03-01), Hayes et al.
patent: 5123902 (1992-06-01), Muller et al.
patent: 5267856 (1993-12-01), Wolbrasht et al.
patent: 5617851 (1997-04-01), Lipkover
patent: 6056738 (2000-05-01), Marchitto et al.
patent: 6077660 (2000-06-01), Wong et al.
patent: 6114187 (2000-09-01), Hayes
patent: 6173202 (2001-01-01), Eppstein
patent: 6177151 (2001-01-01), Chrisey et al.
patent: 6240306 (2001-05-01), Rohrscheib et al.
patent: 6251100 (2001-06-01), Flock et al.
patent: 6334851 (2002-01-01), Hayes et al.
Hayes Donald J.
Taylor David W.
Wallace David B.
Haran John T.
Locke Liddell & Sapp LLP
MicroFab Technologies Inc.
Yao Sam Chuan
LandOfFree
Method for fabricating laminated carrier for collecting... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for fabricating laminated carrier for collecting..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating laminated carrier for collecting... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3063343