Curing apparatus for molding compound

Plastic article or earthenware shaping or treating: apparatus – Plural reshaping means or plural vulcanizing means including... – Spaced reshaping or vulcanizing means acting on a single...

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425374, 425394, 425446, 425DIG127, B29C 4322, B29C 4352

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active

054842760

ABSTRACT:
An apparatus for curing a sheet molding compound which comprises at least one pair of molds disposed along a path of transport of the sheet molding compound. The molds defines a cavity therebetween for passage of the sheet molding compound, which has been generally semi- cured and shaped by a shaping apparatus to a predetermined shape, to heat the generally semi-cured sheet molding compound. At least one of the molds is in the form of a movable mold effective to vary a cross-sectional shape of the cavity to follow a thermal expansion and shrinkage which take place in the sheet molding compound during a curing process.

REFERENCES:
patent: 1873279 (1932-08-01), Brown
patent: 2874751 (1959-02-01), Norton
patent: 3883285 (1975-05-01), De Mets
patent: 3897189 (1975-07-01), Thompson
patent: 3981666 (1976-09-01), Wadman
patent: 4216179 (1980-08-01), Lamberts et al.
patent: 4302167 (1981-11-01), Maffeis et al.
patent: 4645632 (1987-02-01), Bottger et al.
patent: 4647417 (1987-03-01), Bottger et al.
patent: 4956140 (1990-09-01), Rolles et al.
patent: 5352110 (1994-10-01), Hayakawa et al.

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