Semiconductor device and method of making the same

Details Semiconductor device and method of making the same Semiconductor device and method of making the same

2000-04-21

2003-09-16

Picardat, Kevin M. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S118000, C438S124000, C438S126000, C438S127000, C257S783000, C257S782000

Reexamination Certificate

active

06620652

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a semiconductor device of the type which comprises a semiconductor chip attached to a substrate by anisotropic conductive adhesive. The present invention also relates to a method of making such a semiconductor device.
2. Description of the Related Art
FIG. 8
of the accompanying drawings shows an example of conventional semiconductor device, which is generally represented by reference sign
1
A. The conventional device
1
A includes an insulating substrate
2
A and a semiconductor chip
3
A mounted on the substrate
2
A. The semiconductor chip
3
A is bonded to the substrate
2
A by an anisotropic conductive adhesive
4
A. The illustrated adhesive
4
A is made up of a thermosetting resin material
41
A containing conductive substances
40
A.
As illustrated, the semiconductor chip
3
A is provided with connection terminals (conductive bumps)
30
A, while the substrate
2
A is provided with connection pads
20
A. Each connection terminal
30
A of the chip
3
A is electrically connected to a corresponding one of the connection pads
20
A on the substrate
2
A via conductive substances
40
A in the adhesive
4
A. The semiconductor chip
3
A is mechanically connected to the substrate
2
A by the thermosetting resin material
41
A in the adhesive
4
A. The substrate
2
A is formed with through-holes
21
A corresponding in position to the connection pads
20
A. Ball-like terminals
6
A of solder are formed at the respective through-holes
6
A to be electrically connected to the connection pads
20
A.
As stated above, in the above conventional semiconductor device
1
A, the mechanical bonding between the substrate
2
A and the semiconductor chip
3
A depends only on the thermosetting resin material
41
A. Thus, disadvantageously, the semiconductor chip
3
A may fail to be attached firmly to the substrate
2
A. Consequently, the chip
3
A may be accidentally detached from the substrate
2
A rather easily upon application of an external force. Even if the chip
3
A is only shifted in position relative to the substrate
2
A, the device
1
A may suffer from the short-circuiting of the wiring pattern.
SUMMARY OF THE INVENTION
The present invention has been proposed under the circumstances described above.
It is an object of the present invention to provide a semiconductor device in which a semiconductor chip is reliably attached to a base member.
Another object of the present invention is to provide a method of making such a semiconductor device.
According to a first aspect of the present invention, there is provided a semiconductor device which comprises a semiconductor chip, a base member for mounting the chip, anisotropic conductive adhesive arranged between the chip and the base member, and a package for enclosing the chip and the adhesive. The chip is secured to the base member by the adhesive and the package.
With such an arrangement, the chip is attached to the base member not only by the adhesive but also by the package. Thus, even if the bonding force of the adhesive is not strong enough, the package prevents the chip from being detached from the base member.
In a preferred embodiment, the package is held in direct contact with the base member.
The chip may be provided with at least one connection terminal, while the base member may be provided with at least one counterpart terminal held in facing relation to the connection terminal of the chip to be electrically connected thereto.
Preferably, the chip may have a bonding surface and side surfaces connected to the bonding surface. The adhesive may be held in contact with the bonding surface and a portion of each of the side surfaces.
Preferably, the base member may be an insulating substrate. The insulating substrate may be made of a glass-fiber-reinforced epoxy resin material or ceramic material for example.
Alternatively, the base member may comprise a film element having a bonding area reinforced for mounting the chip. It is possible to achieve the reinforcement of the bonding area by fixing a rigid plate, resin layer or wiring pattern to the bonding area.
In a preferred embodiment, the base member may comprise an additional semiconductor chip.
Preferably, the chip, the adhesive and the base member may be embedded in the package.
The conductive adhesive may comprise a thermosetting resin material containing conductive substances. This thermosetting resin material, before being caused to permanently set, is less rigid than a portion of the base member on which the chip is mounted.
Preferably, the package may be made of a thermosetting resin material which, prior to permanent setting, is less rigid than a portion of the base member on which the chip is mounted.
According to a second aspect of the present invention, there is provided a method of making a semiconductor device provided with a semiconductor chip, a base member and a protection package. The method may comprise the steps of: applying anisotropic conductive adhesive between the chip and the base member; provisionally attaching the chip to the base member by rendering the adhesive semi-solid; and forming the protection package to enclose the chip and the adhesive. The adhesive is rendered solid at the protection package forming step for securing the chip to the base member.
Preferably, the chip may be urged toward the base member by contraction of the protection package. The contraction may occur when the package solidifies and cools down.


REFERENCES:
patent: 5866953 (1999-02-01), Akram et al.
patent: 5918113 (1999-06-01), Higashi et al.
patent: 6133637 (2000-10-01), Hikita et al.
patent: 6204564 (2001-03-01), Miyata et al.
patent: 9-22965 (1993-07-01), None

Affiliated with

Also associated with

Rating

Semiconductor device and method of making the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method of making the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method of making the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3039868