Heatsink device

Details Heatsink device Heatsink device

2002-04-17

2003-04-22

Bennett, Henry (Department: 3743)

Heat exchange

With retainer for removable article

Electrical component

C165S185000, C165S104330, C165S104260, C361S700000, C361S697000, C257S715000

Reexamination Certificate

active

06550529

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a heatsink device, and more particularly to a heatsink device for dissipating the heat produced from a heat emitting body, such as a central processor of a computer, wherein the heatsink device may be manufactured and assembled easily, and the parts may be combined more rigidly and stably after assembly.
2. Description of the Related Art
A conventional heatsink device in accordance with the prior art shown in
FIG. 1
comprises a plurality of heatsink plates
90
combined with each other. Each of the heatsink plates
90
is preferably made of heat conductive feature, such as copper. Each of the heatsink plates
90
is formed with a through hole
91
which has a periphery formed with a protruding annular wall
92
. Each of the heatsink plates
90
has two sides each provided with a leg
93
, so that the multiple heatsink plates
90
may be separated by the legs
93
. The through holes
91
of the multiple heatsink plates
90
are aligned with each other for passage of a heat conductive post
94
. One end of the heat conductive post
94
may be bonded on a heat emitting body, such as a central processor, so that the heat produced from the heat emitting body may be conducted through the heat conductive post
94
to the multiple heatsink plates
90
, and may be conveyed outward to the environment.
The outer diameter of the heat conductive post
94
is greater than the inner diameter of the inner wall
92
of each of the heatsink plates
90
, whereby the heat conductive post
94
may be forced into the inner wall
92
of each of the heatsink plates
90
in a close fit by a diameter difference, so that the heat conductive post
94
may be combined with the multiple heatsink plates
90
. Thus, when the diameter difference of the heat conductive post
94
and the inner wall
92
of each of the heatsink plates
90
is greater, the heat conductive post
94
cannot be forced into the inner wall
92
of each of the heatsink plates
90
easily, and when the diameter difference of the heat conductive post
94
and the inner wall
92
of each of the heatsink plates
90
is smaller, the heat conductive post
94
cannot combined with the inner wall
92
of each of the multiple heatsink plates
90
rigidly, and the heat conductive material is worse relatively.
SUMMARY OF THE INVENTION
The primary objective of the present invention is to provide a heatsink device, wherein the heat conductive post may be combined with the heatsink plates easily and conveniently.
A secondary objective of the present invention is to provide a heatsink device, wherein the heat conductive post may be combined with the heatsink plates more rigidly and stably.
In accordance with the present invention, there is provided a heatsink device that includes a plurality of heatsink plates each made of heat conductive material. Each of the heatsink plates if formed with at least one through hole. A periphery of the through hole is formed by an annular wall or sidewalls which define at least one opening. A heat conductive post formed as a rod and made of heat conductive material is forced to fittingly insert into the through hole, so that the heat conductive post may be combined with the heatsink plates more rigidly and stably.
Further benefits and advantages of the present invention will become apparent after a careful reading of the detailed description with appropriate reference to the accompanying drawings.


REFERENCES:
patent: 2216778 (1940-10-01), Houdry
patent: 2574142 (1951-11-01), Buongirno
patent: 2585912 (1952-02-01), Buschow et al.
patent: 3189087 (1965-06-01), Parris
patent: 3216095 (1965-11-01), Kurtz et al.
patent: 3543069 (1970-11-01), Schmidt
patent: 5509465 (1996-04-01), Lai
patent: 6006827 (1999-12-01), Lu
patent: 6382307 (2002-05-01), Wang et al.

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