Semiconductor device and semiconductor device assembly

Details Semiconductor device and semiconductor device assembly Semiconductor device and semiconductor device assembly

2001-12-12

2003-09-09

Smith, Matthew (Department: 2825)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S693000, C438S025000, C438S026000, C438S051000, C438S064000, C438S106000, C438S108000

Reexamination Certificate

active

06617675

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to a semiconductor device having a semiconductor element equipped with an electrode on an electrode patterned surface for external connection, and to a semiconductor assembly including a work piece having the semiconductor device mounted thereon.
BACKGROUND OF THE INVENTION
As a semiconductor device assembly including a semiconductor device having a semiconductor element package, an assembly is known in which an electrode projection, e.g. a solder bump, provided on the semiconductor device are joined to a corresponding circuitry electrode of a work piece. In order to ensure reliability in the assembly after the mounting, it is necessary to reduce stress exerted on a joint at the electrode projection such as the solder bump.
In a conventional semiconductor assembly, stress is derived from a difference of respective thermal expansions between the semiconductor element and the work piece due to a change in an ambient temperature after the mounting, and the stress concentrates particularly on the joint. The thermal stress, which is repeatedly exerted at upon heat cycling, may injure the joint and thus impair the reliability after the mounting.
SUMMARY OF THE INVENTION
A semiconductor device and a semiconductor device assembly are provided and both ensure reliability after mounting.
The semiconductor device includes a semiconductor element having an electrode patterned surface and an external connection electrode provided on the electrode patterned surface. Under the situation where the external connection electrode is joined to a corresponding circuitry electrode on a work piece, the semiconductor element can deflect between two adjacent external connection electrodes according to a contraction displacement of the work piece.


REFERENCES:
patent: 4021766 (1977-05-01), Aine
patent: 5311059 (1994-05-01), Banerji et al.
patent: 5585311 (1996-12-01), Ko
patent: 5892271 (1999-04-01), Takeda et al.
patent: 5897336 (1999-04-01), Brouillette et al.
patent: 5925930 (1999-07-01), Farnworth et al.
patent: 5956575 (1999-09-01), Bertin et al.
patent: 6030854 (2000-02-01), Mashimoto et al.
patent: 6228680 (2001-05-01), Thomas
patent: 6238938 (2001-05-01), Smith
patent: 6277669 (2001-08-01), Kung et al.
patent: 6410364 (2002-06-01), Hashimoto
patent: 9-199631 (1997-07-01), None
Drexler et al. “Thermally induced deformations in a flip-chip HDI substrate” Electronic components and technology conference 2000 proceedings p. 650-656.*
Fujiuchi et al. “Collective screen printing for carrier bump and SMT pads” Electronic manufacturing technology Symposium 1995 18th IEEE/CPMT international Dec. 4-6, 1995 p. 109-112.*
E.S. Drexler, “Plastic strain in thermally cycled flip-chip PBGA solder bumps” IEEE transactions on advanced packaging vol. 23 No. 4, Nov. 4, 2000, p. 646-651.

Affiliated with

Also associated with

Rating

Semiconductor device and semiconductor device assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and semiconductor device assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and semiconductor device assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3027267