Cleaning and liquid contact with solids – Processes – Using solid work treating agents
Reexamination Certificate
2000-07-28
2003-09-30
Gulakowski, Randy (Department: 1746)
Cleaning and liquid contact with solids
Processes
Using solid work treating agents
C134S008000, C134S034000, C451S040000, C451S053000
Reexamination Certificate
active
06627002
ABSTRACT:
BACKGROUND OF THE INVENTION
This invention relates in general to a process for treating electrostatographic imaging members and, more specifically, to a process for removing adhesives from the interior of hollow cylindrical electrostatographic imaging members Electrostatographic imaging members, such as photoreceptors, are conventionally utilized for copiers and printers and comprise a hollow electrically conductive drum substrate, which has been dip coated with various coatings, including at least one photoconductive coating comprising pigment particles dispersed in a film-forming binder. These drum type photoreceptors are usually supported on an electrically conductive shaft by drum supporting hubs or end flanges. The hubs are usually constructed of plastic material and have a hole through their center into which a supporting axle shaft is inserted. Since hubs are usually constructed of electrically insulating plastic material, any suitable electrical grounding means such as a flexible spring steel metal strip is secured to the hub and positioned to contact both the electrically conductive axle shaft and the electrically conductive metal substrate of the photoreceptor drum. One type of grounding means is illustrated In U.S. Pat. No. 4,561,763.
Often the hub or end flange is secured to the end of the drum by a resin adhesive. The use of an adhesive increases the number of steps and complexity of equipment required to disassemble a hub and cylindrical member assembly. Recycling of used drums having glued hubs is difficult, if not impossible, because of damage to the hub, or to the drum or to both during removal of the hub from the drum by common techniques such as by hammering. Such removal techniques damage or destroy both the drum and the hub. Further, where disassembly is accomplished without damage, cleaning of both the hub and the cylindrical substrate is required to remove adhering adhesive. Such removal is particularly difficult when the adhesive is a thermosetting adhesive. Although solvents may be employed to remove thermoplastic adhesives, such solvents can damage drum coatings of new drums. Moreover, solvent handling requires complex equipment such as special solvent recovery units and is time intensive. Alternate methods such as mechanical abrasion or immersion in liquid nitrogen render the photoreceptor unusable due to distortion and mechanical abrasion.
Thus, there is a continuing need for improved photoreceptors that are more reliable and facilitate recycling.
INFORMATION DISCLOSURE STATEMENT
U.S. Pat. No. 5,853,128 issued to Bowen et al. on Dec. 29, 1998—Method and apparatus are disclosed for controlling the exit velocity of solid/gas carbon dioxide spray cleaning systems. By increasing the pressure of liquid carbon dioxide in the supply line, typically In the range of 800-875 psi, to greater than 875 psi, preferably 2,000-5,000 psi and above, the velocity of the spray stream exiting the nozzle is increased enabling removal of contamination (oils, fingerprints, particles, graffiti, etc.) not removable with a spray stream using conventional carbon dioxide pressures. The apparatus includes the incorporation of a high-pressure pump in the liquid carbon dioxide supply line in combination with a nozzle having a first or inlet orifice smaller in diameter than the supply line and a second or exit orifice larger in diameter than the inlet orifice.
U.S. Pat. No. 5,782,263 issued to Isaacson, Jr. et al. on Jul. 21, 1998—A flood control device
200
is disclosed which measures the volume of fluid delivered in a continuous steady flow to a house or building and which shuts off the fluid flow if a preset maximum limit is reached, indicating overly high consumption due to a leak, break or open faucet in the plumbing of the house or building.
U.S. Pat. No. 5,766,368 issued to Bowers on Jun. 16, 1998—A method is disclosed of cleaning an integrated circuit chip module prior to attaching wire bonds thereto. The method involves disposing a module containing an integrated circuit chip and IC bond pads without wire bonds in an environmental process enclosure. A carbon dioxide jet spray cleaning system having a spray nozzle and orifice assembly is disposed the environmental process enclosure. A jet spray of carbon dioxide is generated using the jet spray cleaning system. The carbon dioxide jet spray is directed onto the surface of the module such that the spray impacts the IC bond pads and module bond pads to clean unwanted adhesive from the surface of the module and thus clean the IC and module bond pads.
U.S. No. 5,514,024 issued to Goenka on May 7, 1996—CO
2
nozzle is disclosed which expels liquid CO
2
under pressure through an orifice therein for converting the liquid into CO
2
snow. The CO
2
nozzle is contained within an elongated mixing cavity within a body which is coupled to an exhaust nozzle for directing the CO
2
snow toward the workpiece. The CO
2
nozzle includes several wings for creating aerodynamic turbulence within the elongated mixing cavity for enhancing the coagulation of the CO
2
snow into larger CO
2
snow particles or CO
2
snowflakes.
U.S. Pat. No. 5,431,740 issued to Swain on Jul. 11, 1995—An apparatus is disclosed for cleaning cylindrical surfaces includes a plurality of cleaning stations. Each cleaning station is designed to receive a substrate and includes a plurality of nozzles. The inlet end of each nozzle is connected to a source of liquid Carbon Dioxide, and the outlet end of each nozzle is connected to one end of a respective Carbon Dioxide expansion chamber. Liquid Carbon dioxide leaving each nozzle is converted to solid Carbon Dioxide in the corresponding expansion chamber. The other end of each Carbon Dioxide expansion chamber is coupled to a respective funnel which is, in turn, connected to a dispersing saddle. The dispersing saddles disperse the stream of solid Carbon Dioxide particles leaving each funnel and direct these particles to the substrate surface. The dispersing saddles are placed such that the entire circumference of the substrate surface is enveloped within the various streams of solid Carbon Dioxide particles. In addition, the apparatus may include a source of a dry nonreactive gas which is introduced into each stream of solid Carbon Dioxide particles in order to reduce condensation on the surface from the surface of the substrate and to further direct each stream of solid Carbon Dioxide particles to the substrate surface.
U.S. Pat No. 5,372,652 issued to Srikrishnan et al. on Dec. 13, 1994—An aerosol cleaning apparatus is disclosed for cleaning a substrate includes an aerosol producing means having a nozzle head. The nozzle head is positioned at a selected proximity and orientation to the substrate which is held by a rotatable holder. The aerosol spray dislodges particles from the substrate and the rotation of the substrate further assists in the removal of the loosened particles. A method of aerosol cleaning includes rotating a substrate at a preselected speed and spraying an aerosol jet in conjunction with the rotation to help in the removal of particles from the substrate.
U.S. Pat. No. 5,294,261 issued to McDermott et al. on Mar. 15, 1994—A method is disclosed for cleaning microelectronic surfaces using an aerosol of at least substantially solid argon or nitrogen particles which impinge upon the surface to be cleaned and then evaporate and the resulting gas is removed by venting along with the contaminants dislodged by the cleaning method.
U.S. Pat. No. 5,209,028 to McDermott et al, issued May 11, 1993—An apparatus is disclosed for cleaning semi-conductor solid surfaces using a spray of frozen cryogen, such as argon, to impinge on the solid surface to remove contaminant particles. The apparatus includes an appropriate nozzle positioned in a housing designed for ultra clean conditions including sweep gas supply and evacuation conduits and a support table movably positioned within the housing to controllably convey the semi-conductor solid surface on a track under the spray of frozen cryogen emanating from the nozzle.
U.S.
Caccamise Leslie W.
Crump David P.
Foltz Robert S.
Hammond Harold F.
McCumiskey Robert E.
Gulakowski Randy
Palazzo E. O.
Perrin Joseph
Thompson Robert T
Xerox Corporation
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