Wirebonded microelectronic packages including heat...

Details Wirebonded microelectronic packages including heat... Wirebonded microelectronic packages including heat...

2001-10-04

2003-03-18

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S699000, C361S700000, C361S707000, C257S687000, C257S704000, C257S706000, C257S707000, C257S714000, C257S715000, C174S015100, C174S015200, C174S016300, C165S080300, C165S080400

Reexamination Certificate

active

06535388

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to apparatus and methods for the removal of heat from electronic devices. In particular, the present invention relates to a heat sink for the removal of heat from an active surface of a wirebonded microelectronic die.
2. State of the Art
Microelectronic dice are typically housed in a protective covering referred to as a package or packaging. In one such package
200
, as shown in
FIGS. 6 and 7
, a microelectronic die
202
is positioned in a recess
204
of a substrate
206
. The microelectronic die
202
contains integrated circuitry formed therein (not shown). A back surface
208
of the microelectronic die
202
is preferably attached in the substrate recess
204
by a first layer of adhesive
212
. A plurality of bond pads
214
is disposed on an active surface
216
of the microelectronic die
202
, as shown in FIG.
7
. The bond pads
214
are generally placed near the edges of the microelectronic die active surface
216
and are electrically connected by bond wires
218
to corresponding conductive fingers or traces
222
on the substrate
206
.
Generally, portions of the conductive traces
222
are disposed on multiple tiers in the substrate recess
204
(shown as first tier
224
and second tier
226
) for more effective attachment of the bond wires
218
. The substrate
206
usually comprises a layer or multiple layers of dielectric material with the conductive traces
222
extending therethrough and/or therebetween (not shown), wherein the conductive traces
222
are in contact with external electrically connection devices, such as solder ball or pins (not shown), which may connect the package
200
to external electrical devices.
A lid
228
covers the recess
204
and may be attached to a first surface
232
of the substrate by a second layer of adhesive
234
. The lid
228
prevents environmental contamination of the microelectronic die
202
, the bond pads
214
, the bond wires
218
, and/or the conductive traces
222
, which may lead to the damage or destruction thereof.
In another embodiment as shown in
FIG. 8
, an encapsulant material
236
may be disposed in the substrate recess
204
to prevent environmental contamination, rather than the attachment of a lid
228
, as shown in FIG.
6
.
Of course, higher performance, lower cost, increased miniaturization, and greater packaging density of integrated circuits are ongoing goals of the computer industry. As these goals are achieved, microelectronic dice
202
become smaller. Accordingly, the density of power consumption of the integrated circuit components in the microelectronic die
202
has increased, which, in turn, increases the average junction temperature of the microelectronic die
202
. If the temperature of the microelectronic die
202
becomes too high, the integrated circuits of the microelectronic die
202
may be damaged or destroyed. Generally, with surface mounted microelectronic dice, such as flip-chips and quad flat packs, heat is dissipated from the back surface thereof with the attachment of heat slugs, heat pipes, heat spreaders, and the like. With wirebonded microelectronic die packages described above, heat also can be drawn out of a back surface
238
of the package
200
through the substrate
206
with the attachment of a heat dissipation device. However, the substrate
206
is general made of an organic laminate, which is a poor thermal conductor. Thus, in some cases, the substrate
206
may be made of a thermally conductive ceramic or may have an integrated heat dissipation device
242
to draw heat out of the microelectronic die back surface
208
, as shown in FIG.
9
.
However, as thermal management issues continue to arise, it would be advantageous to develop apparatus and techniques to effectively remove additional heat from a wirebonded microelectronic dice while requiring minimal changes to the current wirebond package process.


REFERENCES:
patent: 5130889 (1992-07-01), Hamburgen et al.
patent: 5455457 (1995-10-01), Kurokawa
patent: 5880524 (1999-03-01), Xie
patent: 6029343 (2000-02-01), Wieloch
patent: 6084297 (2000-07-01), Brooks et al.
patent: 6087682 (2000-07-01), Ando
patent: 6146921 (2000-11-01), Barrow
patent: 6163458 (2000-12-01), Li

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