Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate
2001-05-31
2003-04-08
Dunn, Tom (Department: 1725)
Metal fusion bonding
Process
Preplacing solid filler
C228S245000, C228S180220, C228S033000, C228S041000, C219S121600, C219S121630
Reexamination Certificate
active
06543677
ABSTRACT:
Applicants hereby claim foreign priority benefits to Japanese Patent Application No. 2000-189148, filed Jun. 23, 2000.
BACKGROUND OF THE INVENTION
1. Technical Field
The present invention relates to a device and method for solder-ball bonding a bonding pad formed on a slider on which a head is placed with a lead pad formed at an end of the lead in a head gimbal assembly, which is a constituting part of a hard disk device.
2. Description of the Related Art
Referring now to
FIGS. 8 and 9
, a head gimbal (HG) assembly
100
is configured of an actuator arm
101
that has an opening
102
, and a load beam
104
that extends from the central portion of the flat portion
103
of the actuator arm
101
in the lengthwise direction, to which a part that overlaps the actuator arm
101
is welded. The opening
102
is used when the HG assembly
100
is pivotably held by the HG assembly holder of a magnetic disk device (not shown), and the HG assembly
100
pivots around a virtual axis
150
that passes through the center of the opening
102
substantially vertically to the flat portion
103
in the directions of arrows A and B.
A mounting plate
105
is welded over the nearly central portion of a load beam
104
, and flexure
106
is disposed over the center-to-end portion of the load beam
104
. The half of the flexure
106
on the side of the mounting plate
105
is welded to the load beam
104
, but the end-side half is not welded.
As
FIG. 8
shows, an arch-shaped opening
107
is formed on the end portion of the flexure
106
, and a slider
109
is fixed by bonding on the flexure tongue
106
a
(
FIG. 9
) projecting from the platform
108
in the endmost portion of the flexure
106
toward the center of the arch-shaped opening
107
. The flexure tongue
106
a
is held at a point in the position corresponding to the central portion of the slider
109
by a pivot
104
a
projecting from the load beam
104
(shown by a broken line in FIG.
9
). Thereby the slider
109
can be tilted in relative to the load beam
104
at a predetermined angle (often called pitch, roll, or yaw) in all directions.
Parts of four leads
110
to
113
are laid along the extension
105
a
that extends from the mounting plate
105
, and fixed to the extension
105
a
via an insulating sheet not to contact to each other. The one end of the extension
105
a
forms a multi-connector
114
.
The four leads
110
to
113
are laid on the mounting plate
105
and the flexure
106
in the pattern shown in
FIG. 7
, and similarly fixed to them via insulating sheets not to contact to each other. The other end of each lead is floated in the arch-shaped opening
107
as shown in
FIG. 8
, and each of two leads is bent in a crank shape in pairs and reaches the platform
108
.
Here, the paired leads are bent substantially perpendicularly so as to face the front surface
109
a
of the slider
109
through two openings
114
and
115
formed between the platform
108
and the flexure tongue
106
a
(FIG.
9
), and form lead pads
110
a
to
113
a
corresponding to pad-bonding surfaces of four bonding pads
116
to
119
formed on the front surface
109
a
, respectively. The four leads
110
to
113
are fixed to the platform
108
through an insulating sheet
120
near the end portions. The portion other than the slider
109
of the above-described HG assembly corresponds to the slider holding means.
Next, the method for electrically connecting the four bonding pads
116
to
119
with correspondingly formed lead pads
110
a
to
113
a
using a conventional solder-ball bonding device will be described.
FIG. 9
shows a schematic diagram of a conventional solder-ball bonding device. The optical system
131
that configures the solder-ball bonding device
130
inputs laser beam generated by a laser oscillator (not shown) through optical fibers
132
, passes the laser beam through a condenser lens system for condensing the laser beam to converged beam, and outputs the converged beam to the hollow portion
134
a
of a capillary
134
through a laser-beam path
133
a
of the solder-ball feeder
133
.
The hollow portion
134
a
of a capillary
134
mounted to the solder-ball feeder
133
is a path of the converged laser beam, as well as a solder-ball supplying path as described later. The tip of the capillary
134
is cut into a wedge shape, and forms a discharging opening
134
b
led to the hollow portion
134
a
. The solder-ball feeder
133
comprises a laser-beam path
133
a
that connects the optical system
131
and the hollow portion
134
a
of the mounted capillary
134
, a stocker
133
b
for stocking a plurality of solder balls
135
, a solder-ball transporting disc
133
c
that is rotatably held in the solder-ball feeder
133
by driving means (not shown), an introducing pipe
133
d
for introducing nitrogen gas N
2
from a nitrogen-gas cylinder
8
(not shown) through a tube
136
, and a ventilating path
133
e
for guiding the introduced nitrogen gas N
2
to the laser-beam path
133
a.
The solder-ball transporting disc
133
c
has a predetermined number of solder-ball accommodating holes
133
f
equidistantly formed on the circumference of a predetermined radius from the center of rotation, and a solder-ball accommodating hole
133
f
accommodates a solder ball
135
that falls when the solder-ball accommodating hole
133
f
is moved to the position that coincides with the hole (not shown) formed on the bottom of the stocker
133
b
. When the solder-ball transporting disc
133
c
rotates and the solder-ball accommodating hole
133
f
that accommodates a solder ball is moved into the ventilating path
133
e
, the solder ball
135
falls automatically, and is fed into the capillary
134
by nitrogen gas N
2
that is flowing in the arrow direction in the ventilating path
133
e.
The solder-ball transporting disc
133
c
is so configured that another solder-ball accommodating hole
133
f
formed on the solder-ball transporting disc
133
c
is then moved to the position that coincides with the hole (not shown) formed on the bottom of the stocker
133
b
. Thus, each time the solder-ball transporting disc
133
c
rotates by a predetermined angle in the timing described below, the above-described transportation is repeated, and a solder ball is fed into the capillary
134
.
The solder-ball bonding device
130
configured as described above is held by a transporter (not shown) slidably in the F-G direction (vertical direction), which can utilize gravity. On the other hand, on solder-ball bonding, as
FIG. 9
shows, the HG assembly
100
is held by a holder (not shown) so that the pad bonding surface
118
a
of the bonding pad
118
is substantially perpendicular to the bonding surface
112
b
of the lead pad
112
a
, and so that each of them is tilted by about 45 degrees to the above described F-G direction.
The partial sectional view of the HG assembly
100
in
FIG. 9
corresponds to the sectional view of the cross section in
FIG. 8
along the line
151
that passes through the center of the bonding pad
118
viewed from the direction of the arrow C. The HG assembly
100
and the solder-ball bonding device
130
thus held are relatively positioned so that the tip of the capillary
134
equidistantly approaches the bonding pad
118
and the lead pad
112
a
when the solder-ball bonding device
130
moves a predetermined distance in the G direction as
FIG. 9
shows.
When solder-ball bonding is carried out in the above-described configuration, the tip of the capillary
134
is first positioned most close to the pad bonding surface
118
a
of the bonding pad
118
and the bonding surface
112
b
of the lead pad
112
a
, but does not touch these as
FIG. 9
shows.
Next, the solder-ball transporting disc
133
c
is rotated by a predetermined angle to feed a solder ball
135
into the capillary
134
through the N
2
-gas ventilating path
133
e
. This solder ball
135
falls in the capillary
134
, and is guided by the discharging opening
134
b
until it stops at the position where it touches the pad bonding surface
118
a
of
Pattanaik Surya
Satoh Takuya
Tsuchiya Tatsumi
Yoshida Tatsushi
Bracewell & Patterson L.L.P.
Edmondson L.
Martin Robert B.
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