Interconnect mechanics for electromagnetic coupler

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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C174S255000, C257S690000

Reexamination Certificate

active

06498305

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates generally to the field of electronic systems. More particularly, the present invention relates to the field of coupling of signals for communication in electronic systems.
2. Description of the Related Art
A typical multidrop signal distribution system comprises a device at one end of a bus and multiple devices electrically coupled to that bus by a respective coupling requiring direct metal to metal contact. Each device along the bus, however, acts electrically as a lumped capacitive load on the bus, lowering both line impedance and signal propagation speed on the bus. As a result, such a system experiences increased power dissipation, requires increased power to drive the bus in order to achieve a desired signal-to-noise ratio, and experiences increased delays for signal reception at distant points along the bus.
The lumped capacitive loads also cause impedance discontinuities and reflections for signals transmitted at relatively high frequencies. In practice, such a system may only use a relatively short bus as compared to the wavelength of the fundamental frequency transmitted over the bus. Such a system may therefore transmit only relatively low frequency, and therefore relatively long wavelength, signals.


REFERENCES:
patent: 3516065 (1970-06-01), Bolt et al.
patent: 3619504 (1971-11-01), De Veer et al.
patent: 3740675 (1973-06-01), Moore et al.
patent: 4654843 (1987-03-01), Roza et al.
patent: 4838797 (1989-06-01), Dodier
patent: 4876535 (1989-10-01), Ballmer et al.
patent: 4969824 (1990-11-01), Casciotti
patent: 5073761 (1991-12-01), Waterman et al.
patent: 5171154 (1992-12-01), Casciotti et al.
patent: 5197888 (1993-03-01), Brodsky et al.
patent: 5308249 (1994-05-01), Renn et al.
patent: 5315617 (1994-05-01), Guida et al.
patent: 5385476 (1995-01-01), Jasper
patent: 5432486 (1995-07-01), Wong
patent: 5470240 (1995-11-01), Suzuki
patent: 5629838 (1997-05-01), Knight et al.
patent: 5638402 (1997-06-01), Osaka et al.
patent: 5667388 (1997-09-01), Cottrell
patent: 5793668 (1998-08-01), Krakovyak
patent: 5838727 (1998-11-01), Lyon et al.
patent: 5977841 (1999-11-01), Lee et al.
patent: 6005895 (1999-12-01), Perino et al.
patent: 6007357 (1999-12-01), Perino et al.
patent: 6039595 (2000-03-01), Tseng et al.
patent: 6218916 (2001-04-01), Ishikawa et al.
patent: 6281848 (2001-08-01), Nagumo et al.
patent: 6333719 (2001-12-01), Varadan et al.
patent: 2001/0024888 (2001-09-01), Marketkar et al.
patent: WO00/72163 (2000-11-01), None
U.S. patent application No. 09/318,287, filed May 25, 1999, entitled High-Speed Digital Distribution System, by Thomas F. Knight, Jr. and Nandu J. Marketkar.
U.S. patent application No. 09/751,442, filed Dec. 29, 2000, entitled Clamp to Secure Carrier to Device for Electromagnetic Coupler, by Nandu J. Marketkar, Mark E. Naylor and John L. Critchlow.
U.S. patent application No. 09/751,527, filed Dec. 29, 2000 entitled Electromagnetic Coupler Socket, by Nandu J. Marketkar, Thomas F. Knight, Jr., Mark E. Naylor and John L. Critchlow.
U.S. patent application No. 09/751,526, filed Dec. 29, 2000, entitled Electromagnetic Coupler Alignment, by Nandu J. Marketkar and Thomas F. Knight, Jr.
Farjad-Rad, Ramin, et al., “A 0.3-&mgr;m CMOS 8-Gb/s 4-PAM Serial Link Transceiver”, IEEE Journal of Solid-State Circuits, vol. 35, No. 5, pp. 757-764 (May 2000).
Osaka, Hideki, High Performance Memory Interface for DDR-SDRAM II: XTL (Crosstalk Transfer Logic), Hitachi Ltd., Systems Development Laboratory, pp. 1-20 (Sep. 15, 2000).
Stearns, Thomas H., Flexible Printed Circuitry, McGraw-Hill Companies, Inc., pp. 109-110 and 232-235 (1996).
XTL Evaluation System, Hitachi Ltd., Systems Development Laboratory, pp. 1-14 (Sep. 15, 2000).
Yang, Chih-Kong Ken, et al., “A 0.5-&mgr;m CMOS 4.0-Gbit/s Serial Link Transceiver with Data Recovery Using Oversampling”, IEEE Journal of Solid-State Circuits, vol. 33, No. 5, pp. 713-722 (May 1998).

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