Test probe alignment apparatus

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor

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324 73PC, G01R 3122

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active

042661919

ABSTRACT:
Test probe alignment apparatus for the alignment of test probes for testing integrated circuits includes three separate stages in which the theta stage is separate from the X-Y stage and the Z stage is separate from both the theta stage and the X-Y stage.

REFERENCES:
patent: 3333274 (1967-07-01), Forcier
patent: 3849728 (1974-11-01), Evans
patent: 3949295 (1976-04-01), Moorshead
patent: 3996517 (1976-12-01), Fergason et al.
patent: 4092593 (1978-05-01), Wolk
patent: 4103232 (1978-07-01), Sugita et al.
Kehagioglou, Mirrored Alignment Gauge, IBM Technical Disclosure Bulletin, Oct. 1978, pp. 1962, 1963.
Rottmann, X-Y Alignment Tables with Angular Compensation, IBM Technical Disclosure Bulletin, Nov. 1967, pp. 798 & 799.
Beldring et al., Fiber Optic Sensor for Testing & Sorting Semiconductor Devices, Western Elec. Tech. Digest, No. 33, Jan. 1974, pp. 11 & 12.
Prilik et al., Semiconductor Wafer & Module Test Station Transport Mechanism, IBM Tech. Disl. Bull., Oct. 1975, pp. 1517 & 1518.
Groenick et al., Integrated Circuit Full Wafer Diagnostic Using Special Test Stage for Scanning Electron Microscope, IBM Technical Disclosure Bulletin, Jul. 1978, pp. 638 & 639.
Schuelke, Integrated Circuit Chip Positioning Tool, IBM Technical Disclosure Bulletin, Dec. 1970, pp. 2115, 2116.

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