Positioning of soldering pads in semiconductor diode package

Details Positioning of soldering pads in semiconductor diode package Positioning of soldering pads in semiconductor diode package

2000-10-18

2002-10-15

Chaudhuri, Olik (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

C257S778000, C257S779000, C257S780000, C257S781000, C257S784000

Reexamination Certificate

active

06465885

ABSTRACT:

BACKGROUND OF THE INVENTION
(1) Field of Invention
This invention relates to semiconductor diode packages, particular to photoelectric diodes.
(2) Brief Description of Related Art
FIG. 1
shows a prior art method for soldering a semiconductor diode
10
to two metal contacts
11
and
12
. Solders
103
m
and
104
m
are placed over the contact
11
and
12
respectively for soldering to the electrodes of the semiconductor diode
10
. When the package is heated for soldering, the solders
103
m
and
104
m
melt and may spread. If the solders
103
m
and
104
m
spread, the diode
10
may be displaced from the desired position. This displacement is undesirable, especially for photoelectric devices where the positioning of the light source or light sensor is critical
SUMMARY
An object of this invention is to position a diode accurately in a semiconductor package.
Another of this invention is to prevent the solder in a package from spreading.
These objects are achieved in this invention by coating the surrounding of the soldering pads with insulating material which prevents spreading. Then the soldering islands can accurately mate with the electrodes of the diode.


REFERENCES:
patent: 4766479 (1988-08-01), Krum et al.
patent: 5914536 (1999-06-01), Shizuki et al.
patent: 5917242 (1999-06-01), Ball
patent: 6104091 (2000-08-01), Ito et al.
patent: 6157080 (2000-12-01), Tamaki et al.

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