Stack type semiconductor package

Details Stack type semiconductor package Stack type semiconductor package

1990-02-09

1991-02-26

Hille, Rolf

357 68, H01L 2348, H01L 2354

Patent

active

049965832

ABSTRACT:
In a semiconductor device, an outer lead is divided into plural leads at an outer lead region connected to an inner lead which is connected to an electrode terminal of a semiconductor chip, a plurality of TAB packages on which the semiconductor chip has been packaged are stacked in plural layers, at least one of the plural divided leads every stacked layers is left and a predetermined number of the divided leads are cut out, and these stacked TAB packages are mounted on a circuit board.

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